生命周期: | Obsolete | 包装说明: | FBGA, BGA63,10X12,32 |
Reach Compliance Code: | compliant | 风险等级: | 5.84 |
Is Samacsys: | N | 最长访问时间: | 30 ns |
命令用户界面: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PBGA-B63 | 内存密度: | 134217728 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
部门数/规模: | 1K | 端子数量: | 63 |
字数: | 8388608 words | 字数代码: | 8000000 |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 8MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA63,10X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
页面大小: | 256 words | 并行/串行: | PARALLEL |
电源: | 3.3 V | 认证状态: | Not Qualified |
就绪/忙碌: | YES | 部门规模: | 8K |
最大待机电流: | 0.00005 A | 子类别: | Flash Memories |
最大压摆率: | 0.02 mA | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
切换位: | NO | 类型: | NAND TYPE |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F2816U0C-HIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2816U0C-HIB00 | SAMSUNG |
获取价格 |
Flash, 8MX16, 30ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, TBGA-63 | |
K9F2816U0C-HIB0T | SAMSUNG |
获取价格 |
Flash Memory | |
K9F2816U0C-PCB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2816U0C-PCB00 | SAMSUNG |
获取价格 |
Flash, 8MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9F2816U0C-PIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2816U0C-YCB0 | SAMSUNG |
获取价格 |
16M x 8 Bit , 8M x 16 Bit NAND Flash Memory | |
K9F2816U0C-YCB00 | SAMSUNG |
获取价格 |
Flash, 8MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F2816U0C-YIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit , 8M x 16 Bit NAND Flash Memory | |
K9F2G08B0B | SAMSUNG |
获取价格 |
256M x 8 Bit NAND Flash Memory |