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K6T4016C3B-RF70T PDF预览

K6T4016C3B-RF70T

更新时间: 2024-12-01 13:09:07
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
9页 149K
描述
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44

K6T4016C3B-RF70T 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:TSOP, TSOP44,.46,32Reach Compliance Code:compliant
风险等级:5.88Is Samacsys:N
最长访问时间:70 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G44JESD-609代码:e0
内存密度:4194304 bit内存集成电路类型:STANDARD SRAM
内存宽度:16端子数量:44
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装等效代码:TSOP44,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL电源:5 V
认证状态:Not Qualified反向引出线:YES
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.13 mA标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUALBase Number Matches:1

K6T4016C3B-RF70T 数据手册

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CMOS SRAM  
K6T4016C3B Family  
Document Title  
256Kx16 bit Low Power CMOS Static RAM  
Revision History  
Revision No.  
History  
Draft Data  
Remark  
0.0  
Initial draft  
June 28, 1996  
Advance  
0.1  
Revise  
September 19, 1996  
Preliminary  
- Die name change ; A to B  
1.0  
2.0  
Finalize  
December 17, 1996  
February 17, 1997  
Final  
Final  
Revise  
- Operating current update and release.  
ICC(Read/Write) = 30/60 ® 15/75mA  
ICC1(Read/Write) = 30/60 ® 15/75mA  
ICC2 = 160 ® 130mA  
3.0  
4.0  
Revise  
February 17, 1998  
June 22, 1998  
Final  
Final  
- Change datasheet format  
- Remove ICC write value from table.  
Revise  
- Change test load at 55ns: 100pF ® 50pF  
4.01  
5.0  
Errarta correction  
August 8, 1998  
May 22, 2001  
Revise  
Final  
- Add 55ns product for industrial temperature  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
1
Revision 5.0  
May 2001  

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