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K6T0808C1D-TF70T PDF预览

K6T0808C1D-TF70T

更新时间: 2024-11-28 03:17:51
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 170K
描述
Standard SRAM, 32KX8, 70ns, CMOS, PDSO28

K6T0808C1D-TF70T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP, TSSOP28,.53,22Reach Compliance Code:unknown
风险等级:5.92最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G28
JESD-609代码:e0内存密度:262144 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
端子数量:28字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP28,.53,22封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:PARALLEL
电源:5 V认证状态:Not Qualified
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.06 mA标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUALBase Number Matches:1

K6T0808C1D-TF70T 数据手册

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K6T0808C1D Family  
CMOS SRAM  
Document Title  
32Kx8 bit Low Power CMOS Static RAM  
Revision History  
Revision No History  
Draft Data  
Remark  
0.0  
0.1  
Initial draft  
May 18, 1997  
Design target  
First revision  
April 1, 1997  
Preliminily  
- KM62256DL/DLI ISB1 = 100 ® 50mA  
KM62256DL-L ISB1 = 20 ® 10mA  
KM62256DLI-L ISB1 = 50 ® 15mA  
- CIN = 6 ® 8pF, CIO = 8 ® 10pF  
- KM62256D-4/5/7 Family  
tOH = 5 ® 10ns  
- KM62256DL/DLI IDR = 50® 30mA  
KM62256DL-L/DLI-L IDR = 30 ® 15mA  
1.0  
Finalize  
November 11, 1997  
Final  
- Remove ICC write value  
- Improved operating current  
ICC2 = 70 ® 60mA  
- Improved standby current  
KM62256DL/DLI ISB1 = 50 ® 30mA  
KM62256DL-L ISB1 = 10 ® 5mA  
KM62256DLI-L ISB1 = 15 ® 5mA  
- Improved data retention current  
KM62256DL/DLI IDR = 30 ® 5mA  
KM62256DL-L/DLI-L IDR = 15 ® 3mA  
- Remove 45ns part from commercial product and 100ns part  
from industrial product.  
Replace test load 100pF to 50pF for 55ns part  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 1.0  
November 1997  

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