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K4F641612D-TP50T PDF预览

K4F641612D-TP50T

更新时间: 2024-09-24 04:30:15
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
35页 381K
描述
Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50,

K4F641612D-TP50T 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:TSOP, TSOP50,.46,32Reach Compliance Code:compliant
风险等级:5.83最长访问时间:50 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G50
内存密度:67108864 bit内存集成电路类型:FAST PAGE DRAM
内存宽度:16端子数量:50
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP
封装等效代码:TSOP50,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE电源:3.3 V
认证状态:Not Qualified刷新周期:4096
自我刷新:YES最大待机电流:0.0002 A
子类别:DRAMs最大压摆率:0.12 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUALBase Number Matches:1

K4F641612D-TP50T 数据手册

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Industrial Temperature  
K4F661612D,K4F641612D  
CMOS DRAM  
4M x 16bit CMOS Dynamic RAM with Fast Page Mode  
DESCRIPTION  
This is a family of 4,194,304 x 16 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory  
cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-45, -50 or -60), power consumption(Normal or Low power)  
are optional features of this family. All of this family have CAS -before-RAS refresh, RAS-only refresh and Hidden refresh capabilities.  
Furthermore, Self-refresh operation is available in L-version. This 4Mx16 Fast Page Mode DRAM family is fabricated using Samsung¢s  
advanced CMOS process to realize high band-width, low power consumption and high reliability.  
FEATURES  
• Fast Page Mode operation  
• Part Identification  
• 2CAS Byte/Word Read/Write operation  
• CAS-before-RAS refresh capability  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (L-ver only)  
• Fast parallel test mode capability  
• LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
- K4F661612D-TI/P(3.3V, 8K Ref.)  
- K4F641612D-TI/P(3.3V, 4K Ref.)  
ActivePowerDissipation  
Unit : mW  
Speed  
-45  
8K  
4K  
• Available in Plastic TSOP(II) packages  
• +3.3V ±0.3V power supply  
324  
288  
252  
468  
432  
396  
-50  
Industrial Temperature operating ( -40~85°C )  
-60  
Refresh Cycles  
Part  
NO.  
Refresh  
cycle  
Refresh time  
FUNCTIONAL BLOCK DIAGRAM  
Normal  
64ms  
L-ver  
K4F661612D*  
K4F641612D  
8K  
4K  
RAS  
UCAS  
LCAS  
W
128ms  
Vcc  
Control  
Vss  
Clocks  
VBB Generator  
* Access mode & RAS only refresh mode  
: 8K cycle/64ms(Normal), 8K cycle/128ms(L-ver.)  
CAS -before-RAS & Hidden refresh mode  
Lower  
Data in  
Buffer  
DQ0  
to  
DQ7  
Row Decoder  
Refresh Timer  
Refresh Control  
Lower  
Data out  
Buffer  
: 4K cycle/64ms(Normal), 4K cycle/128ms(L-ver.)  
Memory Array  
4,194,304 x 16  
Cells  
OE  
Refresh Counter  
Row Address Buffer  
Col. Address Buffer  
Upper  
Data in  
Buffer  
Performance Range  
DQ8  
to  
DQ15  
Speed  
-45  
tRAC  
45ns  
50ns  
60ns  
tCAC  
12ns  
13ns  
15ns  
tRC  
tPC  
A0~A12  
(A0~A11)*1  
Upper  
Data out  
Buffer  
80ns  
90ns  
110ns  
31ns  
35ns  
40ns  
A0~A8  
(A0~A9)*1  
Column Decoder  
-50  
-60  
Note) *1 : 4K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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