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K4E160411D-BL60 PDF预览

K4E160411D-BL60

更新时间: 2024-11-21 05:35:43
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
21页 256K
描述
EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24

K4E160411D-BL60 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:SOJ, SOJ24/26,.34
针数:24Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.29访问模式:FAST PAGE WITH EDO
最长访问时间:60 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-J24
JESD-609代码:e0长度:17.15 mm
内存密度:16777216 bit内存集成电路类型:EDO DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:24
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装等效代码:SOJ24/26,.34
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
电源:5 V认证状态:Not Qualified
刷新周期:2048座面最大高度:3.76 mm
自我刷新:NO最大待机电流:0.00025 A
子类别:DRAMs最大压摆率:0.1 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
宽度:7.62 mmBase Number Matches:1

K4E160411D-BL60 数据手册

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K4E170411D, K4E160411D  
K4E170412D, K4E160412D  
CMOS DRAM  
4M x 4Bit CMOS Dynamic RAM with Extended Data Out  
DESCRIPTION  
This is a family of 4.194,304 x 4 bit Extended Data Out CMOS DRAMs. Extended Data Out Mode offers high speed random access of  
memory cells within the same row, so called Hyper Page Mode. Power supply voltage (+5.0V or +3.3V), refresh cycle (2K Ref. or 4K  
Ref.), access time (-50 or -60), power consumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of  
this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh  
operation is available in L-version. This 4Mx4 EDO DRAM family is fabricated using Samsung¢s advanced CMOS process to realize high  
band-width, low power consumption and high reliability. It may be used as main memory unit for high level computer, microcomputer and  
personal computer.  
FEATURES  
Part Identification  
• Extended Data Out Mode operation  
(Fast Page Mode with Extended Data Out)  
• CAS-before-RAS refresh capability  
- K4E170411D-B(F) (5V, 4K Ref.)  
• RAS-only and Hidden refresh capability  
- K4E160411D-B(F) (5V, 2K Ref.)  
• Self-refresh capability (L-ver only)  
- K4E170412D-B(F) (3.3V, 4K Ref.)  
- K4E160412D-B(F) (3.3V, 2K Ref.)  
• Fast parallel test mode capability  
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
ActivePowerDissipation  
Unit : mW  
5V  
• Available in Plastic SOJ and TSOP(II) packages  
• Single +5V±10% power supply (5V product)  
• Single +3.3V±0.3V power supply (3.3V product)  
3.3V  
Speed  
4K  
324  
288  
2K  
4K  
2K  
-50  
-60  
396  
360  
495  
440  
605  
550  
FUNCTIONAL BLOCK DIAGRAM  
Refresh Cycles  
Part  
Refresh Refresh period  
RAS  
CAS  
W
Vcc  
Vss  
VCC  
Control  
Clocks  
NO.  
cycle  
Normal L-ver  
VBB Generator  
K4E170411D  
5V  
4K  
64ms  
128ms  
32ms  
Data in  
K4E170412D 3.3V  
K4E160411D 5V  
Buffer  
Row Decoder  
Refresh Timer  
Refresh Control  
Refresh Counter  
2K  
K4E160412D 3.3V  
DQ0  
to  
DQ3  
Memory Array  
4,194,304 x4  
Cells  
Performance Range  
A0-A11  
(A0 - A10)*1  
A0 - A9  
Row Address Buffer  
Col. Address Buffer  
Speed  
-50  
Remark  
20ns 5V/3.3V  
tRAC  
50ns  
60ns  
tCAC  
15ns  
tRC  
tHPC  
Data out  
Buffer  
Column Decoder  
OE  
(A0 - A10)*1  
84ns  
-60  
17ns 104ns 25ns 5V/3.3V  
Note) *1 : 2K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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