是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SSOP | 包装说明: | SSOP, SOP70,.63,32 |
针数: | 70 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.71 |
风险等级: | 5.92 | 最长访问时间: | 100 ns |
其他特性: | ALSO CONFIGURABLE AS 1M X 32 | 备用内存宽度: | 16 |
JESD-30 代码: | R-PDSO-G70 | JESD-609代码: | e0 |
长度: | 28.57 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 70 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX32 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装等效代码: | SOP70,.63,32 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 并行/串行: | PARALLEL |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 3.1 mm | 最大待机电流: | 0.00005 A |
子类别: | MASK ROMs | 最大压摆率: | 0.15 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.8 mm | 端子位置: | DUAL |
宽度: | 12.7 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K3P6C2000B-SC12 | SAMSUNG |
获取价格 |
MASK ROM, 1MX32, 120ns, CMOS, PDSO70, 0.500 INCH, SSOP-70 | |
K3P6C2000B-SC15 | SAMSUNG |
获取价格 |
MASK ROM, 1MX32, 150ns, CMOS, PDSO70, 0.500 INCH, SSOP-70 | |
K3P6S1000D-YC | SAMSUNG |
获取价格 |
MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6S1000D-YE | SAMSUNG |
获取价格 |
MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6S1000D-YE15 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6U1000D-YC | SAMSUNG |
获取价格 |
MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6U1000D-YC10 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6U1000D-YE | SAMSUNG |
获取价格 |
MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6U1000D-YE10 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P6U1000F-GC12 | SAMSUNG |
获取价格 |
MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.500 INCH, SOP-44 |