5秒后页面跳转
K3N3C3000D-DC080 PDF预览

K3N3C3000D-DC080

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 有原始数据的样本ROM光电二极管内存集成电路
页数 文件大小 规格书
3页 45K
描述
MASK ROM, 512KX8, 80ns, CMOS, PDIP32, 0.600 INCH, DIP-32

K3N3C3000D-DC080 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP,
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.71
风险等级:5.92最长访问时间:80 ns
JESD-30 代码:R-PDIP-T32长度:41.91 mm
内存密度:4194304 bit内存集成电路类型:MASK ROM
内存宽度:8功能数量:1
端子数量:32字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX8封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:5.08 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:15.24 mm
Base Number Matches:1

K3N3C3000D-DC080 数据手册

 浏览型号K3N3C3000D-DC080的Datasheet PDF文件第2页浏览型号K3N3C3000D-DC080的Datasheet PDF文件第3页 
K3N3C3000D-D(G)C  
CMOS MASK ROM  
4M-Bit (512Kx8) CMOS MASK ROM  
FEATURES  
GENERAL DESCRIPTION  
· 524,288x8 bit organization  
· Access time : 80ns(Max.)  
· Supply voltage : single +5V  
· Current consumption  
Operating : 50mA(Max.)  
Standby : 50mA(Max.)  
· Fully static operation  
· All inputs and outputs TTL compatible  
· Three state outputs  
The K3N3C3000D-D(G)C is a fully static mask programmable  
ROM organized 524,288 x 8 bit. It is fabricated using silicon  
gate CMOS process technology.  
This device operates with a 5V single power supply, and all  
inputs and outputs are TTL compatible.  
Because of its asynchronous operation, it requires no external  
clock assuring extremely easy operation.  
It is suitable for use in program memory of microprocessor, and  
data memory, character generator.  
· Package  
The K3N3C3000D-DC is packaged in a 32-DIP and the  
K3N3C3000D-GC in a 32-SOP.  
-. K3N3C3000D-DC : 32-DIP-600  
-. K3N3C3000D-GC : 32-SOP-525  
FUNCTIONAL BLOCK DIAGRAM  
PIN CONFIGURATION  
A18  
X
MEMORY CELL  
MATRIX  
BUFFERS  
AND  
.
.
.
.
.
.
.
.
N.C  
A16  
A15  
A12  
A7  
1
2
VCC  
32  
(524,288x8)  
31 A18  
DECODER  
A17  
30  
3
A14  
29  
4
Y
A13  
A8  
5
28  
27  
26  
25  
24  
SENSE AMP.  
BUFFERS  
BUFFERS  
AND  
A6  
6
A5  
A9  
7
DIP  
&
DECODER  
A0  
A4  
8
A11  
SOP  
A3  
9
OE  
.
. .  
A2  
10  
23 A10  
21 CE  
A1  
11  
12  
13  
14  
CE  
OE  
Q0  
Q7  
CONTROL  
LOGIC  
A0  
Q7  
Q6  
21  
20  
Q0  
Q1  
Q2  
VSS  
19 Q5  
Q4  
Q3  
15  
16  
18  
17  
Pin Name  
A0 - A18  
Q0 - Q7  
CE  
Pin Function  
Address Inputs  
Data Outputs  
Chip Enable  
Output Enable  
Power(+5V)  
Ground  
K3N3C3000D-D(G)C  
OE  
VCC  
VSS  
N.C  
No Connection  

与K3N3C3000D-DC080相关器件

型号 品牌 获取价格 描述 数据表
K3N3C3000D-DC10 SAMSUNG

获取价格

MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, DIP-32
K3N3C3000D-DC12 SAMSUNG

获取价格

MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32
K3N3C3000D-DC120 SAMSUNG

获取价格

MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32
K3N3C3000D-GC080 SAMSUNG

获取价格

MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 0.525 INCH, SOP-32
K3N3C3000D-GC10 SAMSUNG

获取价格

MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
K3N3C3000D-GC100 SAMSUNG

获取价格

MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
K3N3C3000D-GC12 SAMSUNG

获取价格

MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, SOP-32
K3N3C3000D-GC120 SAMSUNG

获取价格

MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, SOP-32
K3N3C3000D-YC08 SAMSUNG

获取价格

MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
K3N3C3000D-YC100 SAMSUNG

获取价格

MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32