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K1B5616B2M000000 PDF预览

K1B5616B2M000000

更新时间: 2024-09-17 19:30:31
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
42页 1292K
描述
Pseudo Static RAM, 16MX16, 70ns, CMOS, DIE

K1B5616B2M000000 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIEReach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84最长访问时间:70 ns
JESD-30 代码:R-XUUC-N内存密度:268435456 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:16MX16封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP并行/串行:PARALLEL
认证状态:Not Qualified最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

K1B5616B2M000000 数据手册

 浏览型号K1B5616B2M000000的Datasheet PDF文件第2页浏览型号K1B5616B2M000000的Datasheet PDF文件第3页浏览型号K1B5616B2M000000的Datasheet PDF文件第4页浏览型号K1B5616B2M000000的Datasheet PDF文件第5页浏览型号K1B5616B2M000000的Datasheet PDF文件第6页浏览型号K1B5616B2M000000的Datasheet PDF文件第7页 
Preliminary  
K1B5616B2M  
UtRAM  
256Mb (16M x 16 bit) UtRAM  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND  
IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS  
OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN  
SAMSUNG PRODUCTS OR TECHNOLOGY.  
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUAR-  
ANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or defense  
application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Revision 1.0  
May 2006  
- 1 -  

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