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JS28F512M29EWLA PDF预览

JS28F512M29EWLA

更新时间: 2024-11-30 12:09:31
品牌 Logo 应用领域
镁光 - MICRON 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
75页 855K
描述
Parallel NOR Flash Embedded Memory

JS28F512M29EWLA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:TSSOP, TSSOP56,.8,20针数:56
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.43
Is Samacsys:N最长访问时间:110 ns
备用内存宽度:8命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G56JESD-609代码:e4
长度:18.4 mm内存密度:536870912 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:512
端子数量:56字数:33554432 words
字数代码:32000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小:16/32 words并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:128K最大待机电流:0.000225 A
子类别:Flash Memories最大压摆率:0.031 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:14 mm
Base Number Matches:1

JS28F512M29EWLA 数据手册

 浏览型号JS28F512M29EWLA的Datasheet PDF文件第2页浏览型号JS28F512M29EWLA的Datasheet PDF文件第3页浏览型号JS28F512M29EWLA的Datasheet PDF文件第4页浏览型号JS28F512M29EWLA的Datasheet PDF文件第5页浏览型号JS28F512M29EWLA的Datasheet PDF文件第6页浏览型号JS28F512M29EWLA的Datasheet PDF文件第7页 
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash  
Features  
Parallel NOR Flash Embedded Memory  
JS28F256M29EWxx, PC28F256M29EWxx, RC28F256M29EWxx  
JS28F512M29EWxx, PC28F512M29EWxx, RC28F512M29EWxx  
JS28F00AM29EWxx, PC28F00AM29EWxx, RC28F00AM29EWxx  
PC28F00BM29EWxx, RC28F00BM29EWxx  
• VPP/WP# pin protection  
– Protects first or last block regardless of block  
protection settings  
• Software protection  
Features  
• 2Gb = stacked device (two 1Gb die)  
• Supply voltage  
– VCC = 2.7–3.6V (program, erase, read)  
– VCCQ = 1.65–3.6V (I/O buffers)  
• Asynchronous random/page read  
– Page size: 16 words or 32 bytes  
– Page access: 25ns  
– Random access: 100ns (Fortified BGA);  
110ns (TSOP)  
• Buffer program: 512-word program buffer  
• Program time  
– Volatile protection  
– Nonvolatile protection  
– Password protection  
– Password access  
• Extended memory block  
– 128-word (256-byte) block for permanent, secure  
identification  
– Programmed or locked at the factory or by the  
customer  
– 0.88µs per byte (1.14 MB/s) TYP when using full  
512-word buffer size in buffer program  
• Memory organization  
– Uniform blocks: 128-Kbytes or 64-Kwords each  
• Program/erase controller  
– Embedded byte/word program algorithms  
• Program/erase suspend and resume capability  
– Read from any block during a PROGRAM SUS-  
PEND operation  
– Read or program another block during an ERASE  
SUSPEND operation  
• Low power consumption: Standby mode  
• JESD47H-compliant  
– 100,000 minimum ERASE cycles per block  
– Data retention: 20 years (TYP)  
• 65nm multilevel cell (MLC) process technology  
• Fortified BGA and TSOP packages  
• Green packages available  
– RoHS-compliant  
– Halogen-free  
• Operating temperature  
– Ambient: –40°C to +85°C  
• BLANK CHECK operation to verify an erased block  
• Unlock bypass, block erase, chip erase, and write to  
buffer capability  
– Fast buffered/batch programming  
– Fast block/chip erase  
PDF: 09005aef849b4b09  
m29ew_256mb_2gb.pdf - Rev. B 8/12 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
© 2012 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

JS28F512M29EWLA 替代型号

型号 品牌 替代类型 描述 数据表
JS28F512M29EWHB MICRON

完全替代

Parallel NOR Flash Embedded Memory
JS28F512M29EWHA MICRON

完全替代

Parallel NOR Flash Embedded Memory
JS28F512P30BFA MICRON

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Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard

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