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JS28F256M29EWLA PDF预览

JS28F256M29EWLA

更新时间: 2024-02-09 05:55:24
品牌 Logo 应用领域
镁光 - MICRON 闪存存储
页数 文件大小 规格书
75页 855K
描述
Parallel NOR Flash Embedded Memory

JS28F256M29EWLA 技术参数

生命周期:Transferred零件包装代码:TSOP
包装说明:14 X 20 MM, GREEN, TSOP-56针数:56
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.26
最长访问时间:110 ns备用内存宽度:8
启动块:BOTTOM/TOPJESD-30 代码:R-PDSO-G56
长度:18.4 mm内存密度:268435456 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:56
字数:16777216 words字数代码:16000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL类型:NOR TYPE
宽度:14 mmBase Number Matches:1

JS28F256M29EWLA 数据手册

 浏览型号JS28F256M29EWLA的Datasheet PDF文件第2页浏览型号JS28F256M29EWLA的Datasheet PDF文件第3页浏览型号JS28F256M29EWLA的Datasheet PDF文件第4页浏览型号JS28F256M29EWLA的Datasheet PDF文件第5页浏览型号JS28F256M29EWLA的Datasheet PDF文件第6页浏览型号JS28F256M29EWLA的Datasheet PDF文件第7页 
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash  
Features  
Parallel NOR Flash Embedded Memory  
JS28F256M29EWxx, PC28F256M29EWxx, RC28F256M29EWxx  
JS28F512M29EWxx, PC28F512M29EWxx, RC28F512M29EWxx  
JS28F00AM29EWxx, PC28F00AM29EWxx, RC28F00AM29EWxx  
PC28F00BM29EWxx, RC28F00BM29EWxx  
• VPP/WP# pin protection  
– Protects first or last block regardless of block  
protection settings  
• Software protection  
Features  
• 2Gb = stacked device (two 1Gb die)  
• Supply voltage  
– VCC = 2.7–3.6V (program, erase, read)  
– VCCQ = 1.65–3.6V (I/O buffers)  
• Asynchronous random/page read  
– Page size: 16 words or 32 bytes  
– Page access: 25ns  
– Random access: 100ns (Fortified BGA);  
110ns (TSOP)  
• Buffer program: 512-word program buffer  
• Program time  
– Volatile protection  
– Nonvolatile protection  
– Password protection  
– Password access  
• Extended memory block  
– 128-word (256-byte) block for permanent, secure  
identification  
– Programmed or locked at the factory or by the  
customer  
– 0.88µs per byte (1.14 MB/s) TYP when using full  
512-word buffer size in buffer program  
• Memory organization  
– Uniform blocks: 128-Kbytes or 64-Kwords each  
• Program/erase controller  
– Embedded byte/word program algorithms  
• Program/erase suspend and resume capability  
– Read from any block during a PROGRAM SUS-  
PEND operation  
– Read or program another block during an ERASE  
SUSPEND operation  
• Low power consumption: Standby mode  
• JESD47H-compliant  
– 100,000 minimum ERASE cycles per block  
– Data retention: 20 years (TYP)  
• 65nm multilevel cell (MLC) process technology  
• Fortified BGA and TSOP packages  
• Green packages available  
– RoHS-compliant  
– Halogen-free  
• Operating temperature  
– Ambient: –40°C to +85°C  
• BLANK CHECK operation to verify an erased block  
• Unlock bypass, block erase, chip erase, and write to  
buffer capability  
– Fast buffered/batch programming  
– Fast block/chip erase  
PDF: 09005aef849b4b09  
m29ew_256mb_2gb.pdf - Rev. B 8/12 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
© 2012 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

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