ACPL-K44T
Automotive Wide Operating Temperature 1 MBd Digital Optocoupler
in a Stretched 8-Pin Surface Mount Plastic Package
Reliability Data Sheet
Description
Definition of Failure
The reliability data shown includes Avago Technologies Inability to switch, that is, “functional failure”, is the
reliability test data from the reliability qualification done definition of failure in this data sheet. Specifically, failure
on this product family. All of these products use the occurs when the device fails to switch ON with two times
similar IC, and the same packaging materials, processes, the minimum recommended drive current (but not
stress conditions and testing. The data in Table 1 and exceeding the max rating) or fails to switch off when there
Table 2 reflect actual test data for devices on a per channel is no input current.
basis. Before stress, all devices are preconditioned at MSL
Failure Rate Projections
1 using a solder reflow process (260 °C peak temp) and 20
temperature cycles (-55 °C to +125 °C, 15 mins dwell, 1
min transfer). These data are taken from testing on Avago
Technologies devices using internal Avago Technologies'
process, material specifications, design standards, and
statistical process controls. THEY ARE NOT TRANSFERABLE
TO OTHER MANUFACTURERS’SIMILAR PART TYPES.
The demonstrated point mean time to failure (MTTF) is
measured at the absolute maximum stress condition.
The failure rate projections in Table 2 uses the Arrhenius
acceleration relationship, where a 0.43 eV activation
energy is used as in the hybrid section of MIL-HDBK-217.
Application Information
Operating Life Test
The data of Table 1 and 2 were obtained on devices with
high temperature operating life duration. An exponential
(random) failure distribution is assumed, expressed in
units of FIT (failures per billion device hours) are only
defined in the random failure portion of the reliability
curve.
For valid system reliability calculations, you must adjust
for the time when the system is not in operation. Note: if
you are using MIL-HDBK-217 for predicting component
reliability, the results may not be comparable to those
given in Table 2 due to different conditions and factors
that have been accounted for in MIL-HDBK-217. For
example, it is unlikely that your application will exercise
all available channels at full rated power with the IC
always ON as Avago Technologies testing does. Therefore,
carefully consider your application total power and duty
cycle when you compare Table 2 to predictions using MIL-
HDBK-217.
Table 1. Demonstrated Operating Life Test Performance
Stress Test
Condition
Total Device
Tested
Total Device
Hours
Number of
Failed Units
Demonstrated
MTTF (hr) @
T = +125 °C
a
Demonstrated
FITs @
T = +125 °C
a
Ta = 150 °C
If = 20 mA
Vcc = 30 V
462
346,500
0
> 689,863
< 1,450
Iout = 10 mA
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