1N6103US thru 1N6137AUS
and 1N6139US thru 1N6173AUS
Voidless-Hermetically-Sealed Surface
Mount Bidirectional Transient Suppressors
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This surface mount series of industry recognized voidless-hermetically-
sealed Bidirectional Transient Voltage Suppressor (TVS) designs is
military qualified to MIL-PRF-19500/516 and are ideal for high-reliability
applications where a failure cannot be tolerated. They provide a Working
Peak “Standoff” Voltage selection from 5.2 to 152 Volts with two package
sizes for 500 W and 1500 W ratings. They are very robust in hard-glass
construction and also use an internal metallurgical bond identified as
Category I for high-reliability applications. Both of these are also military
qualified to MIL-PRF-19500/516 and are available as both a non suffix part
and an “A” suffix part involving different voltage tolerances as further
described in note 4 on page 2. These devices are also available in axial-
leaded packages for thru-hole mounting by deleting the “US” suffix (see
separate data sheet for 1N6103 thru 1N6173A). Microsemi also offers
numerous other TVS products to meet higher and lower peak pulse power
and voltage ratings in both through-hole and surface-mount packages.
Package “E”
(or “D-5B”)
Package “G”
(or “D-5C”)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
High surge current and peak pulse power provides
transient voltage protection for sensitive circuits
•
•
•
Military and other high reliability transient protection
Extremely robust construction
•
•
•
•
Triple-layer passivation
Extensive range in Working Peak “Standoff”
Voltage (VWM) from 5.7 to 152 V
Internal “Category I” metallurgical bonds
Voidless hermetically sealed glass package
•
•
•
Available as either 500 W or 1500 W Peak Pulse
Power (PPP) using two different size packages
JAN/TX/TXV military qualifications available per MIL-PRF-
19500/516 by adding JAN, JANTX, or JANTXV prefix
(consult factory for 1N6103US and 1N6138US)
ESD and EFT protection per IEC6100-4-2 and
IEC61000-4-4 respectively
•
•
JANS available for 1N6103AUS thru 1N6118AUS per
MIL-PRF-19500/516 as well as further options for
screening in accordance with MIL-PRF-19500 for JANS
on all others in this series by using a “MSP” prefix, e.g.
MSP6119AUS, MSP6143AUS, etc.
Secondary lightning protection per select levels in
IEC61000-4-5
•
•
Square-end-cap terminals for easy placement
Nonsensitive to ESD per MIL-STD-750 Method
1020
Axial-leaded equivalents also available (see separate
data sheet for 1N6103 thru 1N6173)
•
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating (TJ) & Storage Temperature: -55oC to +175oC
•
•
CASE: Hermetically sealed voidless hard glass with
Tungsten slugs
• Peak Pulse Power (PPP) at 25oC: 500 W for 1N6103US to
1N6137AUS and 1500 W for 1N6139US to 1N6173AUS @
10/1000 µs (also see Figures 1,2 and 3)
TERMINATIONS: End caps are Copper with
Tin/Lead (Sn/Pb) finish. Note Previous inventory
had solid Silver (Ag) with Tin/Lead (Sn/Pb) finish.
• Impulse repetition rate (duty factor): 0.01%
•
•
MARKING: None
• Steady-State Power: 3.0 W for 1N6103US to 1N6137AUS
and 5.0 W for 1N6139US to 1N6173AUS up to TEC = 150oC.
Linearly derate above TEC =150oC to zero at TEC =175oC.
POLARITY: No polarity marking for these
bidirectional TVSs
•
•
Tape & Reel option: Standard per EIA-481-B
Weight: 539 mg for 500 Watt (E Package)
1100 mg for 1500 Watt (G Package)
• Steady-State Power: 2.0 W for 1N6103US to 1N6137AUS
and 3.0 W for 1N6139US to 1N6173AUS @ TA = 25oC (see
note and Figure 4 for linear derating at higher temperatures)
• Thermal Resistance (junction to endcap): 8.3 oC/W for
1N6103US to 1N6137AUS and 5.0 oC/W for 1N6139US to
1N6173AUS
•
See package dimensions and recommended pad
layouts on last page for both the “E” (D-5B) and “G”
(D-5C) size packages
• Solder Temperatures: 260oC for 10 s (maximum)
NOTE: Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from
mounting point to ambient is sufficiently controlled where TOP or TJ(MAX) is not exceeded
Copyright © 2008
05-06-2008 REV D
Microsemi
Scottsdale Division
Page 1
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
5秒后页面跳转
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
