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JANTXV1N5809URS PDF预览

JANTXV1N5809URS

更新时间: 2024-11-07 04:41:39
品牌 Logo 应用领域
美高森美 - MICROSEMI 快速恢复能力电源超快恢复二极管快速恢复二极管超快速恢复能力电源
页数 文件大小 规格书
7页 126K
描述
Rectifier Diode, 1 Phase, 1 Element, 3A, 100V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2

JANTXV1N5809URS 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:MELF包装说明:HERMETIC SEALED, GLASS, MELF-2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.86其他特性:HIGH RELIABILITY, METALLURGICALLY BONDED
应用:ULTRA FAST RECOVERY外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:O-LELF-R2
最大非重复峰值正向电流:125 A元件数量:1
相数:1端子数量:2
最高工作温度:175 °C最低工作温度:-65 °C
最大输出电流:3 A封装主体材料:GLASS
封装形状:ROUND封装形式:LONG FORM
认证状态:Qualified参考标准:MIL-19500
最大重复峰值反向电压:100 V最大反向恢复时间:0.03 µs
表面贴装:YES端子形式:WRAP AROUND
端子位置:END

JANTXV1N5809URS 数据手册

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TECHNICAL DATA SHEET  
6 Lake Street, Lawrence, MA 01841  
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803  
Website: http://www.microsemi.com  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298  
VOIDLESS - HERMETICALLY- SEALED  
ULTRAFAST RECOVERY GLASS RECTIFIERS  
Qualified per MIL-PRF-19500/477  
DEVICES  
LEVELS  
JAN  
Leaded  
1N5807  
1N5809  
1N5811  
JANTX  
JANTXV  
JANS  
Surface Mount 1N5807US  
1N5807URS  
1N5809US  
1N5809URS  
1N5811US  
1N5811URS  
DESCRIPTION  
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and  
is ideal for high-reliability applications where a failure cannot be tolerated. These industry-  
recognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are  
hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical  
bond. These devices are available in both leaded and surface mount MELF package  
configurations. Microsemi also offers numerous other rectifier products to meet higher and  
lower current ratings with various recovery time speed requirements including standard, fast and  
ultrafast device types in both through-hole and surface mount packages.  
B-Body  
Leaded Package  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
Popular JEDEC registered 1N5807, 1N5809, 1N5811  
Voidless hermetically sealed glass package  
Extremely robust construction  
Internal “Category I” Metallurgical bonds  
JAN, JANTX, JANTXV, and JANS available per MIL-PRF-19500/477  
Surface mount versions available in a square end-cap MELF configuration with “US”  
suffix  
B-Body  
Surface Mount  
MELF PACKAGE  
T4-LDS-0168 Rev. 2 (111089)  
Page 1 of 7  

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