PD - 91549C
IRFN250
JANTX2N7225U
JANTXV2N7225U
POWER MOSFET
SURFACE MOUNT(SMD-1)
REF:MIL-PRF-19500/592
200V, N-CHANNEL
HEXFET® MOSFETTECHNOLOGY
Product Summary
Part Number
RDS(on)
ID
IRFN250
0.100 Ω
27.4A
HEXFET® MOSFET technology is the key to International
Rectifier’s advanced line of power MOSFET transistors. The
efficient geometry design achieves very low on-state re-
sistance combined with high transconductance. HEXFET
transistors also feature all of the well-established advan-
tages of MOSFETs, such as voltage control, very fast switch-
ing, ease of paralleling and electrical parameter temperature
stability. They are well-suited for applications such as switch-
ing power supplies, motor controls, inverters, choppers,
audio amplifiers, high energy pulse circuits, and virtually
any application where high reliability is required. The
HEXFET transistor’s totally isolated package eliminates the
need for additional isolating material between the device
and the heatsink. This improves thermal efficiency and
reduces drain capacitance.
SMD-1
Features:
n
n
n
n
n
n
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Surface Mount
Dynamic dv/dt Rating
n Light-weight
Absolute Maximum Ratings
Parameter
Units
I
@ V
@ V
= 10V, T = 25°C
Continuous Drain Current
27.4
D
GS
C
A
I
= 10V, T = 100°C Continuous Drain Current
17
110
D
GS
C
I
Pulsed Drain Current ➀
Max. Power Dissipation
Linear Derating Factor
DM
@ T = 25°C
P
150
W
W/°C
V
D
C
1.2
V
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➀
Avalanche Current ➀
±20
GS
E
500
mJ
A
AS
I
27.4
15
AR
E
AR
dv/dt
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➀
Operating Junction
mJ
V/ns
5.0
T
-55 to 150
J
T
Storage Temperature Range
Package Mounting Surface Temperature
Weight
oC
g
STG
300(for 5 seconds)
2.6 (Typical)
For footnotes refer to the last page
www.irf.com
1
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