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JANSR2N7498T2 PDF预览

JANSR2N7498T2

更新时间: 2024-11-17 22:25:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管脉冲
页数 文件大小 规格书
8页 130K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE ( TO-39)

JANSR2N7498T2 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:CYLINDRICAL, O-MBCY-W3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.37
Is Samacsys:N其他特性:RADIATION HARDENED
雪崩能效等级(Eas):300 mJ外壳连接:DRAIN
配置:SINGLE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):7 A最大漏极电流 (ID):7 A
最大漏源导通电阻:0.24 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-205AFJESD-30 代码:O-MBCY-W3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:METAL
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):25 W最大脉冲漏极电流 (IDM):28 A
认证状态:Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:WIRE端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

JANSR2N7498T2 数据手册

 浏览型号JANSR2N7498T2的Datasheet PDF文件第2页浏览型号JANSR2N7498T2的Datasheet PDF文件第3页浏览型号JANSR2N7498T2的Datasheet PDF文件第4页浏览型号JANSR2N7498T2的Datasheet PDF文件第5页浏览型号JANSR2N7498T2的Datasheet PDF文件第6页浏览型号JANSR2N7498T2的Datasheet PDF文件第7页 
PD - 93857B  
IRHF57230SE  
JANSR2N7498T2  
200V, N CHANNEL  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE ( TO-39)  
REF:MIL-PRF-19500/706  
™
TECHNOLOGY  
R
5
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
QPL Part Number  
IRHF57230SE 100K Rads (Si)  
0.247.0A JANSR2N7498T2  
TO-39  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space appli-  
cations. These devices have been characterized for  
Single Event Effects (SEE) with useful performance  
Features:  
n
Single Event Effect (SEE) Hardened  
up to an LET of 80 (MeV/(mg/cm2)). The combination n Ultra Low RDS(on)  
of low RDS(on) and low gate charge reduces the power n Neutron Tolerant  
n
Identical Pre- and Post-Electrical Test Conditions  
losses in switching applications such as DC to DC  
converters and motor control. These devices retain n Repetitive Avalanche Ratings  
all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of paral-  
leling and temperature stability of electrical param-  
eters.  
n
n
n
n
Dynamic dv/dt Ratings  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
7.0  
4.5  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current ➀  
Max.Power Dissipation  
Linear Derating Factor  
Gate-to-SourceVoltage  
28  
DM  
@ T = 25°C  
P
D
25  
W
W/°C  
V
C
0.2  
V
±20  
130  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
mJ  
A
AS  
I
7.0  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
2.5  
mJ  
V/ns  
AR  
dv/dt  
4.2  
T
-55 to 150  
J
oC  
T
STG  
StorageTemperature Range  
Lead Temperature  
Weight  
300 (0.063 in./1.6mm from case for 10s)  
0.98 (Typical)  
g
For footnotes refer to the last page  
www.irf.com  
1
09/10/03  

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