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JAN2N7484

更新时间: 2024-11-29 09:47:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
22页 203K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

JAN2N7484 数据手册

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INCH-POUND  
The documentation and process conversion  
measures necessary to comply with this revision  
shall be completed by 21 August 2010.  
MIL-PRF-19500/702C  
21 May 2010  
SUPERSEDING  
MIL-PRF-19500/702B  
30 May 2007  
PERFORMANCE SPECIFICATION SHEET  
SEMICONDUCTOR DEVICE, FIELD EFFECT RADIATION HARDENED  
(TOTAL DOSE AND SINGLE EVENT EFFECTS)  
TRANSISTOR, N-CHANNEL, SILICON, TYPES 2N7482T3, 2N7483T3, AND 2N7484T3,  
JANTXVR, F, G, AND H AND JANSR, F, G, AND H  
This specification is approved for use by all Departments  
and Agencies of the Department of Defense.  
The requirements for acquiring the product described herein shall consist of  
this specification sheet and MIL-PRF-19500.  
1. SCOPE  
1.1 Scope. This specification covers the performance requirements for an N-Channel, enhancement-mode,  
MOSFET, radiation hardened (total dose and single event effects (SEE)), power transistor. Two levels of product  
assurance are provided for each device type as specified in MIL-PRF-19500, with avalanche energy maximum rating  
(EAS) and maximum avalanche current (IAS). See 6.5 for JANHC and JANKC die versions.  
1.2 Physical dimensions. See figure 1, (TO-257AA, T3).  
1.3 Maximum ratings. TA = +25°C, unless otherwise specified.  
Type  
PT (1)  
TC =  
+25°C  
PT  
TA =  
+25°C  
VDS  
VDG  
VGS  
ID1 (3) (4) ID2 (3) (4)  
IS  
IDM (5)  
A (pk)  
TJ  
and  
TSTG  
R θJC (2)  
TC =  
+100°C  
TC = +25°C  
W
W
V dc  
V dc  
V dc  
A dc  
A dc  
A dc  
°C/W  
°C  
2N7482T3  
2N7483T3  
2N7484T3  
75  
75  
75  
1.56  
1.56  
1.56  
30  
60  
30  
60  
±20  
±20  
±20  
18  
18  
18  
18  
18  
14  
18  
18  
18  
72  
72  
72  
1.67  
1.67  
1.67  
-55  
to  
+150  
100  
100  
(1) Derate linearly 0.6 W/°C for TC > +25°C.  
(2) See figure 2, thermal impedance curves.  
(3) The following formula derives the maximum theoretical ID specs. ID is limited to 18A by package  
and device construction.  
-
TJM TC  
( on ) at  
TJM  
=
ID  
(
)
x
(
)
RθJC  
RDS  
(4) See figure 3, maximum drain current graph.  
(5) IDM = 4 X ID1, as defined in note (3).  
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,  
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to  
Semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of  
this address information using the ASSIST Online database at https://assist.daps.dla.mil/.  
AMSC N/A  
FSC 5961  

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