IN5518BUR-1 thru 1N5546BUR-1
(or MLL5518B-1 thru MLL5546B-1)
Low Voltage Surface Mount
500 mW Avalanche Diodes
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface
mount Zener voltage regulators provides a selection from 3.3 to 33 volts in
standard 5% tolerances as well as tighter tolerances identified by different
suffix letters on the part number. These have an internal-metallurgical-bond
option as identified by the “–1” suffix. This internally bonded Zener package
construction is also in JAN, JANTX, and JANTXV military qualifications.
Microsemi also offers numerous other Zener products to meet higher and
lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Surface mount equivalent to JEDEC registered
•
Regulates voltage over a broad operating current
1N5518 thru 1N5546 series
and temperature range
•
•
Internal metallurgical bond with the “-1” suffix
•
•
Extensive selection from 3.3 to 33 V
Also available in JAN, JANTX, and JANTXV
qualifications per MIL-PRF-19500/437 by adding
the JAN, JANTX, or JANTXV prefixes to part
numbers for desired level of screening; (e.g.
JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.)
Nonbonded types also available without the “-1”
suffix for both the axial and surface mount
packages
DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration
with part numbers 1N5518 thru 1N5546 on
separate data sheets
Standard voltage tolerances are plus/minus 5% with
a “B” suffix, e.g. 1N5518BUR-1, etc.
•
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively, e.g. 1N5518CUR-1,
1N5518DUR-1, etc.
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
•
•
•
•
•
•
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
Operating and Storage temperature: -65ºC to
•
•
•
CASE: Hermetically sealed glass DO-213AA
+175ºC
(SOD80 or MLL34) MELF style package
Thermal Resistance: 100 ºC/W junction to end cap,
or 250ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
Steady-State Power: 0.5 watts at end cap
temperature TEC < 125oC or at ambient TA < 50ºC
when mounted on FR4 PC board as described for
thermal resistance above (see Figure 2 for
derating)
TERMINALS: End caps tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
•
•
•
MARKING: cathode band only
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 2000 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.04 grams
See package dimensions on last page
•
•
Forward voltage @200 mA: 1.1 volts
•
•
Solder Temperatures: 260 ºC for 10 s (max)
Copyright 2003
Microsemi
Page 1
10-31-2003 REV B
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
5秒后页面跳转
AO3401场效应管参数、引脚图、应用原理图
BT131可控硅参数及引脚图、工作原理详解
74LS32芯片参数、引脚图及功能真值表
全球首块英伟达H200交付 黄仁勋“送货上门”
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
