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JAN1N3033CUR-1 PDF预览

JAN1N3033CUR-1

更新时间： 2024-11-19 05:23:07
品牌 Logo 应用领域
美高森美 - MICROSEMI 稳压二极管齐纳二极管测试
页数 文件大小 规格书
3页 192K
描述
1 WATT METAL CASE ZENER DIODES

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中文翻译

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JAN1N3033CUR-1 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active零件包装代码：DO-213AB
包装说明：O-LELF-R2针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.29
其他特性：METALLURGICALLY BONDED外壳连接：ISOLATED
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJEDEC-95代码：DO-213AB
JESD-30 代码：O-LELF-R2JESD-609代码：e0
元件数量：1端子数量：2
封装主体材料：GLASS封装形状：ROUND
封装形式：LONG FORM峰值回流温度（摄氏度）：225
极性：UNIDIRECTIONAL最大功率耗散：1 W
认证状态：Qualified参考标准：MIL-19500/115K
标称参考电压：36 V表面贴装：YES
技术：ZENER端子面层：Tin/Lead (Sn/Pb)
端子形式：WRAP AROUND端子位置：END
处于峰值回流温度下的最长时间：20最大电压容差：2%
工作测试电流：7 mABase Number Matches：1

JAN1N3033CUR-1 数据手册

 浏览型号JAN1N3033CUR-1的Datasheet PDF文件第2页浏览型号JAN1N3033CUR-1的Datasheet PDF文件第3页 
1N3016B thru 1N3051B  
1 WATT METAL CASE ZENER DIODES  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This well established zener diode series for the 1N3016 thru 1N3051  
JEDEC registration in the metal case DO-13 package provides a glass  
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability  
applications where it is available in JAN, JANTX, and JANTXV military  
qualifications. Lower voltages are also available in the 1N3821 thru  
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data  
sheet). Microsemi also offers numerous other Zener diode products for a  
variety of other packages including surface mount.  
DO-13  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
•
•
•
Zener Voltage Range: 6.8V to 200V  
Hermetically sealed DO-13 metal package  
Internally solder-bonded construction.  
Also available in JAN, JANTX, JANTXV  
qualifications per MIL-PRF19500/115 by adding the  
JAN, JANTX, or JANTXV prefixes to part numbers  
for desired level of screening, e.g. JANTX1N3016B,  
JANTXV1N3051B, etc.  
•
Regulates voltage over a broad operating current  
and temperature range  
•
•
•
•
•
•
Wide selection from 6.8 to 200 V  
Tight voltage tolerances available  
Low reverse (leakage) currents  
Nonsensitive to ESD  
Hermetically sealed metal package  
Inherently radiation hard as described in Microsemi  
•
Surface mount also available with 1N3016BUR-1  
MicroNote 050  
thru 1N3051BUR-1 series on separate data sheet  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
•
•
Operating Junction and Storage Temperatures:  
•
CASE: DO-13 (DO-202AA), welded, hermetically  
-65oC to +175oC  
sealed metal and glass  
THERMAL RESISTANCE: 50oC/W* junction to lead  
at 0.375 inches (10 mm) from body or 110 oC/W  
junction to ambient when leads are mounted on FR4  
PC board with 4 mm2 copper pads (1 oz) and track  
width 1 mm, length 25 mm  
•
FINISH: All external surfaces are Tin-Lead (Pb/Sn)  
plated and solderable per MIL-STD-750 method  
2026  
POLARITY: Cathode connected case.  
WEIGHT: 1.4 grams.  
•
•
•
•
DC Power Dissipation*: 1.0 Watt at TL < +125oC 3/8”  
(10 mm) from body or 1.0 Watts at TL < +65oC when  
mounted on FR4 PC board as described for thermal  
resistance above (also see Fig 1)  
Tape & Reel option: Standard per EIA-296 (add  
“TR” suffix to part number)  
•
See package dimensions on last page  
•
•
Forward Voltage @ 200 mA: 1.5 Volts.  
Solder Temperatures: 260 o C for 10 s (maximum)  
*
For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20 oC/W  
when mounting DO-13 metal case directly on heat sink.  
Copyright 2003  
Microsemi  
Scottsdale Division  
Page 1  
11-03-2003 REV A  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
123

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