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J211-D74Z PDF预览

J211-D74Z

更新时间: 2024-09-27 11:13:35
品牌 Logo 应用领域
安森美 - ONSEMI 放大器晶体管
页数 文件大小 规格书
9页 361K
描述
N 沟道 RF 晶体管

J211-D74Z 技术参数

是否无铅:不含铅生命周期:Active
包装说明:CYLINDRICAL, O-PBCY-T3Reach Compliance Code:compliant
风险等级:0.49Is Samacsys:N
配置:SINGLEFET 技术:JUNCTION
最高频带:VERY HIGH FREQUENCY BANDJEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3元件数量:1
端子数量:3工作模式:DEPLETION MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.35 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:BOTTOM晶体管应用:AMPLIFIER
晶体管元件材料:SILICONBase Number Matches:1

J211-D74Z 数据手册

 浏览型号J211-D74Z的Datasheet PDF文件第2页浏览型号J211-D74Z的Datasheet PDF文件第3页浏览型号J211-D74Z的Datasheet PDF文件第4页浏览型号J211-D74Z的Datasheet PDF文件第5页浏览型号J211-D74Z的Datasheet PDF文件第6页浏览型号J211-D74Z的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
N-Channel RF Amplifier  
J211, MMBFJ211  
1. Drain  
2. Source  
3. Gate  
Description  
1
2
3
This device is designed for HF/VHF mixer/amplifier and  
applications where process 50 is not adequate. Sufficient gain and  
low−noise for sensitive receivers. Sourced from process 90.  
Bent Lead  
Tape & Reel  
Ammo Packing  
TO−92 3  
CASE 135AR  
MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Notes 1, 2)  
A
Symbol  
Parameter  
Drain−Gate Voltage  
Value  
25  
Unit  
V
V
DG  
G
V
I
Gate−Source Voltage  
Forward Gate Current  
−25  
V
GS  
S
10  
mA  
°C  
NOTE: Source & Drain are  
interchangeable  
GF  
D
T , T  
J
Operating and Storage Junction  
Temperature Range  
−55 to 150  
STG  
SOT−23  
CASE 318−08  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. These ratings are based on a maximum junction temperature of 150°C.  
2. These are steady−state limits. onsemi should be consulted on applications  
involving pulsed or low− duty−cycle operations.  
MARKING DIAGRAM  
AJ  
211  
YWW  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Max  
J211  
(Note 3)  
MMBFJ211  
(Note 3)  
62WM  
Symbol  
Parameter  
Total Device Dissipation  
Derate Above 25°C  
Unit  
mW  
P
D
350  
2.8  
225  
1.8  
1
J211−D74Z  
MMBFJ211  
mW/°C  
°C/W  
R
q
JC  
Thermal Resistance,  
Junction−to−Case  
125  
J211, 62W = Device Code  
A
= Assembly Site  
WW  
Y
M
= Work Week Number  
= Year of Production  
= Date Code  
R
Thermal Resistance,  
Junction−to−Ambient  
357  
556  
°C/W  
q
JA  
3. Device mounted on FR−4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for  
2
the collector lead minimum 6 cm .  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 1997  
1
Publication Order Number:  
August, 2022 − Rev. 3  
MMBFJ211/D  
 

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