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IXZ308N120 PDF预览

IXZ308N120

更新时间: 2024-11-05 11:08:11
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IXYS /
页数 文件大小 规格书
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描述
Z-MOS RF Power MOSFET

IXZ308N120 数据手册

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IXZ308N120  
Z-MOS RF Power MOSFET  
N-Channel Enhancement Mode SwitchModeRFMOSFET
LowCapacitanceZ-MOSTMMOSFETProcess  
Optimized for RFOperation
Ideal for Class C, D, &EApplications
VDSS  
ID25  
= 1200 V  
=
=
=
8.0 A  
2.1 Ω  
RDS(on)  
PDC  
Symbol  
Test Conditions  
Maximum Rat-  
ings  
880 W  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
Continuous  
1200  
1200  
V
V
VDSS  
VDGR  
±20  
±30  
8
V
V
VGS  
VGSM  
ID25  
IDM  
Transient  
Tc = 25°C  
A
Tc = 25°C, pulse width limited by TJM  
Tc = 25°C  
40  
A
8
A
IAR  
Tc = 25°C  
TBD  
mJ  
EAR  
IS IDM, di/dt 100A/µs, VDD VDSS  
Tj 150°C, RG = 0.2Ω  
,
5 V/ns  
dv/dt  
IS = 0  
>200 V/ns  
DRAIN  
880  
440  
3.0  
W
W
W
PDC  
GATE  
Tc = 25°C, Derate 4.4W/°C above 25°C  
Tc = 25°C  
PDHS  
PDAMB  
RthJC  
RthJHS  
0.17 C/W  
0.34 C/W  
SG1 SG2  
SD1  
SD2  
Features  
Isolated Substrate  
high isolation voltage (>2500V)  
min.  
1200  
3.5  
typ.  
max.  
excellent thermal transfer  
Increased temperature and power  
cycling capability  
VGS = 0 V, ID = 4 ma  
VDS = VGS, ID = 250µΑ  
VGS = ±20 VDC, VDS = 0  
V
V
VDSS  
VGS(th)  
IGSS  
IXYS advanced Z-MOS process  
Low gate charge and capacitances  
6.5  
±100  
nA  
easier to drive  
faster switching  
Low RDS(on)  
VDS = 0.8VDSS  
VGS=0  
TJ = 25C  
TJ =125C  
50  
1
IDSS  
µA  
mA  
Very low insertion inductance (<2nH)  
VGS = 20 V, ID = 0.5ID25  
Pulse test, t 300µS, duty cycle d 2%  
2.1  
RDS(on)  
No beryllium oxide (BeO) or other  
hazardous materials  
VDS = 50 V, ID = 0.5ID25, pulse test  
10.1  
S
°C  
°C  
°C  
°C  
g
gfs  
Advantages  
-55  
-55  
+175  
TJ  
Optimized for RF and high speed  
Easy to mount—no insulators needed  
High power density  
175  
TJM  
Tstg  
TL  
+ 175  
1.6mm(0.063 in) from case for 10 s  
300  
3.5  
Weight  

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