IXZ2210N50L2
RF Power MOSFET
N-channel enhancement mode linear RF power MOSFET
Ideal for class AB and C industrial, scienꢀꢁc, medical, and commercial applicaꢀons.
VDSS = 500 V
ID25 = 10 A
Advantages
Features
High Performance RF Package
Easy to mount—no insulators needed
Isolated Substrate
high isolation voltage (>2500V)
excellent thermal transfer
DRAIN 2
DRAIN 1
Increased temperature and power cycling
capability
IXYS RF Low Capacitance Z-MOSTM Process
Very low insertion inductance (<2nH)
GATE 1
GATE 2
No beryllium oxide (BeO) or other
hazardous materials
SG1
SD1
SD2
SG2
Maximum Raꢀngs
Symbol Parameter
Test Conditions
Maximum Units
Drain-source voltage
TJ = 25°C to 150°C
VDSS
500
Drain-gate voltage
TJ = 25°C to 150°C; RGS = 1 M
Continuous
VDGR
500
V
VGS
±20
Gate-source voltage
Transient
VGSM
±30
Continuous drain current
Tc = 25°C
Tc = 25°C
ID25
10
270
A
Package power dissipation per MOSFET
PDC
PDHS
Dissipation to heat-sink per MOSFET
Tc = 25°C, Derate 2 W/°C above 25°C
TAMB = 25°C
200
W
PDAMB
RthJC
RthJHS
Ambient power dissipation
3
Thermal resistance junction to case
0.47
° C/W
° C
Thermal resistance junction to heat-sink
0.65
TJ, TSTG
-55 to 150
Operating and storage junction temperature range
Lead temperature
1.6mm(0.063 in) from case for 10 s
TL
300
Electrical Characterisꢀcs
Symbol Parameter
Test Conditions
Min
Typ
Max
Units
Static
VGS = 0 V, ID = 4 ma
500
V
Breakdown voltage drain to source
BVDSS
IDSS
IGSS
gfs
VDS = 0.8VDSS
VGS= 0
TJ = 25C
TJ =125C
50
1
A
mA
Drain leakage current
VGS = ±20 VDC, VDS = 0
±100
nA
Gate leakage current
Transconductance
Threshold voltage
VDS = 60 V, ID = 0.5ID25, pulse test
3.1
5.4
S
VDS = VGS, ID = 250
4.0
6.5
V
VGS(th)