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IXYH55N120C4H1 PDF预览

IXYH55N120C4H1

更新时间: 2024-11-06 15:19:51
品牌 Logo 应用领域
力特 - LITTELFUSE 双极性晶体管
页数 文件大小 规格书
9页 1091K
描述
这些器件采用我们专有的XPT?薄晶圆技术和最先进的Trench IGBT工艺开发,具有低热阻、低能量损耗、快速切换、低尾电流和高电流密度等特点。 这种IGBT具有650V至1200V的击穿电压,使

IXYH55N120C4H1 数据手册

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IGBT Datasheet  
IXYH55N120C4H1  
1200 V, 55 A XPTTM Gen4 IGBT with Sonic Diode  
High Speed IGBT for 20–50 kHz Switching  
Description:  
Developed using our proprietary XPT™ thin-wafer technology  
and state-of-the-artTrench IGBT process, these devices feature  
reduced thermal resistance, low energy losses, fast switching,  
low tail current, and high current densities.  
Features & Benefits:  
Optimized for Low Switching  
Loss  
High Current Handling Capability  
High Power Density  
PositiveThermal Coefficient of  
VCE(sat)  
Low Gate Drive Requirement  
Anti-Parallel Sonic Diode  
International Standard Package  
Applications:  
Pinout Diagram (TO-247-3L)  
Power Inverters  
UPS  
PFC Circuits  
Battery Chargers  
Welding Machines  
backside  
Motor Drives  
SMPS  
C
Product Summary  
Characteristic  
VCES  
Value  
1200  
55  
Unit  
V
G
A
IC110  
2.50  
42  
V
VCE(sat)  
tfi(typ)  
E
ns  
G
C
E
G: Gate; C: Collector; E: Emitter; backside: Collector  
© 2023 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: XZ 04/19/2023  
1

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