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IXTK180N15P PDF预览

IXTK180N15P

更新时间: 2024-02-29 03:56:44
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IXYS /
页数 文件大小 规格书
5页 168K
描述
PolarHTTM Power MOSFET N-Channel Enhancement Mode

IXTK180N15P 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:4.95其他特性:AVALANCHE RATED
雪崩能效等级(Eas):4000 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):180 A最大漏极电流 (ID):180 A
最大漏源导通电阻:0.01 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-264AAJESD-30 代码:R-PSFM-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):800 W最大脉冲漏极电流 (IDM):380 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

IXTK180N15P 数据手册

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PolarHTTM  
Power MOSFET  
VDSS = 150 V  
ID25 = 180 A  
IXTK 180N15P  
RDS(on) 10 mΩ  
N-Channel Enhancement Mode  
Avalanche Rated  
Symbol  
Test Conditions  
Maximum Ratings  
TO-264 (IXTK)  
VDSS  
VDGR  
TJ = 25° C to 175° C  
TJ = 25° C to 175° C; RGS = 1 MΩ  
100  
100  
V
V
VDSS  
VGSM  
Continuous  
Transient  
20  
30  
V
V
G
ID25  
TC =25° C  
180  
75  
A
A
A
(TAB)  
S
ID(RMS)  
IDM  
External lead current limit  
TC = 25° C, pulse width limited by TJM  
380  
IAR  
TC =25° C  
60  
A
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
EAR  
EAS  
TC =25° C  
TC =25° C  
100  
4
mJ  
J
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150° C, RG = 4 Ω  
,
10  
V/ns  
Features  
TC =25° C  
800  
W
l
International standard package  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
TJ  
TJM  
Tstg  
-55 ... +175  
175  
-55 ... +150  
°C  
°C  
°C  
l
l
TL  
TSOLD  
1.6 mm (0.062 in.) from case for 10 s  
Plastic body for 10 s  
300  
260  
°C  
°C  
Md  
Mounting torque  
1.13/10 Nm/lb.in.  
10  
Characteristic Values  
Advantages  
Weight  
g
l
Easy to mount  
Space savings  
Symbol  
Test Conditions  
l
(TJ = 25° C, unless otherwise specified)  
Min. Typ.  
Max.  
l
High power density  
BVDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 500µA  
VGS = 20 VDC, VDS = 0  
150  
V
V
2.5  
5.0  
200  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
250  
µA  
µA  
TJ = 150° C  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
10 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
DS99297E(12/05)  
© 2005 IXYS All rights reserved  

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