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IXTH13N110 PDF预览

IXTH13N110

更新时间: 2024-11-04 22:11:03
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
2页 49K
描述
MEGA MOS FET

IXTH13N110 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-247AD
包装说明:TO-247AD, 3 PIN针数:3
Reach Compliance Code:compliant风险等级:5.74
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:1100 V最大漏极电流 (Abs) (ID):13 A
最大漏极电流 (ID):13 A最大漏源导通电阻:0.92 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AD
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
功耗环境最大值:360 W最大功率耗散 (Abs):360 W
最大脉冲漏极电流 (IDM):52 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXTH13N110 数据手册

 浏览型号IXTH13N110的Datasheet PDF文件第2页 
IXTH 13N110 VDSS = 1100 V  
MegaMOSTMFET  
ID25  
= 13 A  
RDS(on) = 0.92 Ω  
N-ChannelEnhancementMode  
Symbol  
Test Conditions  
MaximumRatings  
TO-247 AD  
VDSS  
VDGR  
TJ = 25°C to 150°C  
1100  
1100  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
D(TAB)  
VGSM  
ID25  
IDM  
TC = 25°C  
13  
52  
A
A
G = Gate,  
S = Source,  
D = Drain,  
TAB = Drain  
TC = 25°C, pulse width limited by TJM  
PD  
TC = 25°C  
360  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
-55 ... +150  
Md  
Mountingtorque  
1.13/10 Nm/lb.in.  
Weight  
6
g
Maximumleadtemperatureforsoldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Features  
Internationalstandardpackage  
JEDEC TO-247 AD  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Fast switching times  
Applications  
Symbol  
Test Conditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Switch-modeandresonant-mode  
powersupplies  
Motorcontrols  
UninterruptiblePowerSupplies(UPS)  
DC choppers  
VDSS  
VGS = 0 V, ID = 3 mA  
1100  
2
V
V
VGS(th)  
VDS = VGS, ID = 250 µA  
4.5  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100 nA  
500 µA  
Advantages  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
3
mA  
Easy to mount with 1 screw  
(isolated mounting screw hole)  
Space savings  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t 300 µs, duty cycle d 2 %  
0.80  
0.92  
Highpowerdensity  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
92781F (3/98)  
1 - 2  

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