Advance Technical Information
IXGH 35N120C VCES = 1200 V
IGBT
Lightspeed Series
IXGT 35N120C IC25
=
70 A
VCE(sat) = 4.0 V
tfi(typ) = 115 ns
Symbol
TestConditions
MaximumRatings
TO-268
(IXGT)
VCES
VCGR
TJ = 25°C to 150°C
1200
1200
V
V
TJ = 25°C to 150°C; RGE = 1 MW
G
E
VGES
VGEM
Continuous
Transient
±20
±30
V
V
(TAB)
IC25
IC90
ICM
TC = 25°C
70
35
A
A
A
TO-247 AD (IXGH)
TC = 90°C
TC = 25°C, 1 ms
140
SSOA
(RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 5 W
Clampedinductiveload
ICM = 90
@ 0.8 VCES
A
C (TAB)
G
C
E
PC
TC = 25°C
300
W
G = Gate,
E = Emitter,
C = Collector,
TAB = Collector
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
-55 ... +150
Maximum Lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Tab temperature for soldering SMD devices for 10 s
300
260
°C
°C
Features
Md
Mountingtorque(M3)
1.13/10 Nm/lb.in.
• Internationalstandardpackages
JEDEC TO-268 surface and
JEDEC TO-247 AD
Weight
TO-247 AD
TO-268
6
4
g
g
• Low switching losses
• MOS Gate turn-on
- drive simplicity
Applications
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptiblepowersupplies(UPS)
• Switched-modeandresonant-mode
powersupplies
BVCES
VGE(th)
IC = 1 mA, VGE = 0 V
IC = 750 mA, VCE = VGE
1200
2.5
V
V
5
ICES
VCE = VCES
VGE = 0 V
TJ = 25°C
TJ = 125°C
250 mA
mA
Advantages
5
• High power density
IGES
VCE = 0 V, VGE = ±20 V
±100 nA
• Suitableforsurfacemounting
• Easy to mount with 1 screw,
(isolatedmountingscrewhole)
VCE(sat)
IC = IC90, VGE = 15 V
4.0
V
V
TJ = 125°C
3.2
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
98717(4/18/2000)
1 - 2