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IXFR58N20Q PDF预览

IXFR58N20Q

更新时间: 2024-11-05 11:14:07
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
2页 93K
描述
HiPerFET Power MOSFETs ISOPLUS247 Q-Class

IXFR58N20Q 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:ISOPLUS247, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.84
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1000 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):50 A
最大漏极电流 (ID):50 A最大漏源导通电阻:0.04 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):300 W最大脉冲漏极电流 (IDM):232 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFR58N20Q 数据手册

 浏览型号IXFR58N20Q的Datasheet PDF文件第2页 
HiPerFETTM Power MOSFETs  
ISOPLUS247TM Q-Class  
IXFR 58N20Q VDSS = 200 V  
ID25  
=
=
50 A  
RDS(on)  
40 mΩ  
(Electrically Isolated Back Surface)  
trr 200 ns  
N-ChannelEnhancementMode  
AvalancheRated,HighdV/dt  
Low Gate Charge and Capacitances  
Preliminary Data Sheet  
TM  
Symbol  
TestConditions  
Maximum Ratings  
ISOPLUS247  
E153432  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
200  
200  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
G
D
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, Note 1  
TC = 25°C  
50  
232  
58  
A
A
A
Isolated back surface*  
D = Drain  
G = Gate  
S = Source  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
30  
1.0  
mJ  
J
* Patent pending  
Features  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
PD  
TC = 25°C  
300  
W
z Silicon chip on Direct-Copper-Bond  
substrate  
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TL  
1.6 mm (0.062 in.) from case for 10 s  
250  
2500  
5
°C  
V~  
g
z Low drain to tab capacitance(<50pF)  
z IXYS advanced low Qg process  
z Rugged polysilicon gate cell structure  
z Unclamped Inductive Switching (UIS)  
rated  
VISOL  
Weight  
50/60 Hz, RMS  
t = 1 min  
z Fast intrinsic diode  
Applications  
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
DC-DC converters  
Battery chargers  
Switched-mode and resonant-mode  
z
z
VDSS  
VGS = 0 V, ID = 250 µA  
200  
2.0  
V
power supplies  
DC choppers  
z AC motor control  
z
VGS(th)  
VDS = VGS, ID = 4mA  
4.0 V  
IGSS  
VGS = ±20 V, VDS = 0  
±100 nA  
Advantages  
IDSS  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
25 µA  
1 mA  
z
Easy assembly  
Space savings  
High power density  
z
RDS(on)  
VGS = 10 V, ID = 29A  
Note 2  
40 mΩ  
z
© 2003 IXYS All rights reserved  
DS98591B(01/03)  

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