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IXFR55N50F PDF预览

IXFR55N50F

更新时间: 2024-11-04 22:11:55
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
2页 501K
描述
HiPerRF Power MOSFETs F-Class: MegaHertz Switching

IXFR55N50F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:ISOPLUS247, 3 PIN
针数:3Reach Compliance Code:compliant
风险等级:5.82Is Samacsys:N
雪崩能效等级(Eas):3000 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):47 A最大漏极电流 (ID):47 A
最大漏源导通电阻:0.085 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):400 W
最大脉冲漏极电流 (IDM):220 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFR55N50F 数据手册

 浏览型号IXFR55N50F的Datasheet PDF文件第2页 
HiPerRFTM  
IXFR 55N50F VDSS = 500 V  
ID25 = 55 A  
Power MOSFETs  
R
DS(on) = 90 mΩ  
F-Class: MegaHertz Switching  
N-ChannelEnhancementMode  
Avalanche Rated, Low Qg, Low Intrinsic Rg  
High dV/dt, Low trr  
trr 250 ns  
ISOPLUS247TM  
E153432  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 150°C  
500  
500  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
Isolatedbackside*  
VGS  
VGSM  
Continuous  
Transient  
20  
30  
V
V
G = Gate  
D
= Drain  
S = Source TAB = Electrically Isolated  
ID25  
IDM  
IAR  
T
= 25°C  
45  
220  
55  
A
A
A
TC = 25°C, pulse width limited by TJM  
TCC = 25°C  
Features  
z Silicon chip on Direct-Copper-Bond  
EAR  
EAS  
T
= 25°C  
60  
3.0  
mJ  
J
TCC = 25°C  
substrate  
- High power dissipation  
-Isolatedmountingsurface  
-2500Velectricalisolation  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
10  
V/ns  
z RF capable Mosfets  
PD  
TJ  
TC = 25°C  
400  
W
z Lowgatechargeandcapacitances  
- easier to drive  
-40 ... +150  
°C  
TJM  
Tstg  
150  
-40 ... +150  
°C  
°C  
-fasterswitching  
z Lowdraintotabcapacitance(<30pF)  
z Low RDS (on) HDMOSTM process  
z Ruggedpolysilicongatecellstructure  
z Rated for Unclamped Inductive Load  
Switching(UIS)  
TL  
1.6 mm (0.063 in.) from case for 10 s  
50/60 Hz, RMS t = 1 min  
300  
2500  
5
°C  
V~  
g
VISOL  
Weight  
z FastintrinsicRectifier  
Applications  
z
Symbol  
TestConditions  
Characteristic Values  
DC-DC converters  
Batterychargers  
Switched-modeandresonant-mode  
power supplies  
(TJ = 25°C, unless otherwise specified)  
z
min. typ. max.  
z
VDSS  
VGS = 0 V, ID = 1mA  
500  
3.0  
V
z
VGS(th)  
IGSS  
VDS = VGS, ID = 8mA  
VGS = 20 V, VDS = 0  
5.5 V  
DC choppers  
z AC motor control  
200 nA  
Advantages  
IDSS  
VDS = V  
T = 25°C  
TJJ = 125°C  
100 µA  
VGS = 0DVSS  
3 mA  
z
Easy assembly  
Space savings  
z
RDS(on)  
VGS = 10 V, ID = IT  
Notes 2, 3  
90 mΩ  
z
High power density  
DS98814C(06/04)  
© 2004 IXYS All rights reserved  

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