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IXFR26N50 PDF预览

IXFR26N50

更新时间: 2024-11-22 14:56:51
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
3页 119K
描述
功能与特色: 应用: 优点:

IXFR26N50 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
包装说明:IN-LINE, R-PSIP-T3Reach Compliance Code:compliant
风险等级:5.39其他特性:AVALANCHE RATED
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):26 A
最大漏极电流 (ID):24 A最大漏源导通电阻:0.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):250 W最大脉冲漏极电流 (IDM):104 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFR26N50 数据手册

 浏览型号IXFR26N50的Datasheet PDF文件第2页浏览型号IXFR26N50的Datasheet PDF文件第3页 
Advanced Technical Information  
HiPerFETTM Power MOSFETs  
ISOPLUS247TM  
VDSS  
ID25  
RDS(on)  
IXFR 26N50  
IXFR 24N50  
500V  
500V  
24 A  
22 A  
0.20 W  
0.23 W  
(Electrically Isolated Back Surface)  
trr £ 250 ns  
N-Channel Enhancement Mode  
High dV/dt, Low trr, HDMOSTM Family  
ISOPLUS
Symbol  
TestConditions  
MaximumRatings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MW  
500  
500  
V
V
G
D
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
Isolated back surface*  
D = Drain  
ID25  
IDM  
IAR  
TC = 25°C  
26N50  
24N50  
26N50  
24N50  
26N50  
24N50  
26  
24  
104  
96  
26  
24  
A
A
A
A
A
A
G = Gate  
S = Source  
TC = 25°C, Pulse width limited by TJM  
TC = 25°C  
*Patentpending  
EAR  
TC = 25°C  
30  
5
mJ  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
V/ns  
Features  
PD  
TC = 25°C  
250  
W
• SiliconchiponDirect-Copper-Bond  
substrate  
- High power dissipation  
- Isolated mounting surface  
- 2500V electricalisolation  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
• Low drain to tab capacitance(<50pF)  
TL  
1.6 mm (0.062 in.) from case for 10 s  
300  
2500  
6
°C  
V~  
g
• Low R  
HDMOSTM process  
• RuggeDdSp(oon)lysilicon gate cell structure  
• Unclamped Inductive Switching (UIS)  
rated  
VISOL  
Weight  
50/60 Hz, RMS  
t = 1 minute leads-to-tab  
• Fast intrinsic Rectifier  
Applications  
Symbol  
VDSS  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
• DC-DC converters  
• Battery chargers  
• Switched-modeandresonant-mode  
powersupplies  
• DC choppers  
• AC motor control  
min. typ. max.  
VGS = 0 V, ID = 250uA  
500  
2
V
VGS(th)  
IGSS  
VDS = VGS, ID = 4mA  
4
V
VGS = ±20 VDC, VDS = 0  
±100  
nA  
Advantages  
IDSS  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
200  
1
mA  
mA  
• Easy assembly  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = IT  
Notes 1 & 2  
26N50  
24N50  
0.20  
0.23  
W
W
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98526A(2/99)  
1 - 2  

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