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IXFN32N120P PDF预览

IXFN32N120P

更新时间: 2024-11-19 14:56:55
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
6页 148K
描述
功能与特色: 优点: 应用:

IXFN32N120P 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PUFM-X4Reach Compliance Code:compliant
风险等级:5.36Is Samacsys:N
其他特性:AVALANCHE RATED, UL RECOGNIZED雪崩能效等级(Eas):2000 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:1200 V最大漏极电流 (Abs) (ID):32 A
最大漏极电流 (ID):32 A最大漏源导通电阻:0.31 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PUFM-X4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1000 W
最大脉冲漏极电流 (IDM):100 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Nickel (Ni)端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFN32N120P 数据手册

 浏览型号IXFN32N120P的Datasheet PDF文件第2页浏览型号IXFN32N120P的Datasheet PDF文件第3页浏览型号IXFN32N120P的Datasheet PDF文件第4页浏览型号IXFN32N120P的Datasheet PDF文件第5页浏览型号IXFN32N120P的Datasheet PDF文件第6页 
PolarTM HiPerFETTM  
Power MOSFET  
VDSS = 1200V  
ID25 = 32A  
IXFN32N120P  
RDS(on) 310mΩ  
N-Channel Enhancement Mode  
Avalanche Rated  
trr  
300ns  
Fast Intrinsic Diode  
miniBLOC  
E153432  
Symbol  
Test Conditions  
Maximum Ratings  
S
G
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C, RGS = 1MΩ  
1200  
1200  
V
V
VGSS  
VGSM  
Continuous  
Transient  
±30  
±40  
V
V
S
ID25  
IDM  
TC = 25°C  
TC = 25°C, Pulse Width Limited by TJM  
32  
100  
A
A
D
IA  
TC = 25°C  
TC = 25°C  
16  
2
A
J
G = Gate  
S = Source  
D = Drain  
EAS  
Either Source Terminal S can be used as  
the Source Terminal or the Kelvin Source  
( Gate Return ) Terminal.  
dv/dt  
PD  
IS IDM, VDD VDSS, TJ 150°C  
TC = 25°C  
20  
V/ns  
W
1000  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
Features  
z International Standard Package  
z miniBLOC, with Aluminium Nitride  
Isolation  
TL  
TSOLD  
1.6mm (0.062 in.) from Case for 10s  
Plastic Body for 10s  
300  
260  
°C  
°C  
z Isolation Voltage 2500 V~  
z High Current Handling Capability  
z Fast Intrinsic Diode  
VISOL  
50/60 Hz, RMS  
IISOL 1mA  
t = 1 minute  
t = 1 second  
2500  
3000  
V~  
V~  
z Avalanche Rated  
Md  
Mounting Torque  
Terminal Connection Torque  
1.5/13  
1.3/11.5  
Nm/lb.in.  
Nm/lb.in.  
z
Low RDS(on) HDMOSTM Process  
Weight  
30  
g
Advantages  
z
Easy to Mount  
Space Savings  
High Power Density  
z
Symbol  
Test Conditions  
Characteristic Values  
Min. Typ. Max.  
z
(TJ = 25°C, Unless Otherwise Specified)  
BVDSS  
VGS(th)  
IGSS  
VGS = 0V, ID = 3mA  
VDS = VGS, ID = 1mA  
VGS = ±30V, VDS = 0V  
VDS = VDSS, VGS = 0V  
1200  
3.5  
V
V
Applications  
6.5  
z High Voltage Switch-Mode and  
Resonant-ModePower Supplies  
z High Voltage Pulse Power  
Applications  
z High Voltage Discharge Circuits in  
Lasers Pulsers, Spark Igniters, RF  
Generators  
z High Voltage DC-DC Converters  
z High Voltage DC-AC Inverters  
±300 nA  
50 μA  
IDSS  
TJ = 125°C  
5
mA  
RDS(on)  
VGS = 10V, ID = 0.5 • ID25, Note 1  
310 mΩ  
DS99718H(03/10)  
© 2010 IXYS Corporation, All Rights Reserved  

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