Advanced Technical Data
HiPerFETTM
Power MOSFETs
IXFN 32N120
VDSS = 1200V
ID25 32A
RDS(on) = 0.35Ω
=
N-Channel Enhancement Mode
AvalancheRated, Highdv/dt, Lowtrr
D
G
S
S
Symbol
TestConditions
Maximum Ratings
miniBLOC,SOT-227B(IXFN)
E153432
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
1200
1200
V
V
S
G
VGS
Continuous
Transient
30
40
V
V
VGSM
S
ID25
TC = 25°C, Chip capability
32
A
D
IDM
IAR
TC = 25°C, pulse width limited by TJM
TC = 25°C
128
32
A
A
G = Gate
D = Drain
EAR
TC = 25°C
TC = 25°C
64
4
mJ
J
S = Source
TAB = Drain
EAS
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ≤ 150°C, RG = 2 Ω
,
15
V/ns
Features
PD
TC= 25°C
780
W
• International standard package
TJ
-55 ... +150
150
-55 ... +150
°C
°C
°C
• miniBLOC, with Aluminium nitride
isolation
• Low RDS (on) HDMOSTM process
TJM
Tstg
• Rugged polysilicon gate cell
structure
• Unclamped Inductive Switching (UIS)
rated
• Low package inductance
• Fast intrinsic Rectifier
VISOL
Md
50/60 Hz, RMS
ISOL ≤ 1 mA
t = 1 min
t = 1 s
2500
3000
V~
V~
I
Mounting torque
Terminal connection torque
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
Weight
30
g
Applications
Symbol
TestConditions
Characteristic Values
•
•
•
DC-DC converters
Battery chargers
Switched-mode and resonant-mode
power supplies
(TJ = 25°C, unless otherwise specified)
min. typ. max.
VDSS
VGS = 0 V, ID = 3 mA
VDS = VGS, ID = 8 mA
1200
2.5
V
V
VGS(th)
5.0
•
•
DC choppers
Temperature and lighting controls
IGSS
IDSS
VGS(th) = 30 VDC, VDS = 0
200 nA
VDS = VDSS
VGS = 0 V
T = 25°C
TJJ = 125°C
50 µA
3
mA
Advantages
RDS(on)
V
= 10 V, ID = 0.5 • I
0.35
Ω
PuGSlse test, t ≤ 300 µs,D25
duty cycle d ≤ 2 %
•
•
•
Easy to mount
Space savings
High power density
© 2003 IXYS All rights reserved
DS98968B(10/03)