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IXFN25N90 PDF预览

IXFN25N90

更新时间: 2024-11-04 22:41:15
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
4页 144K
描述
HiPerFET Power MOSFETs Single Die MOSFET

IXFN25N90 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FLANGE MOUNT, R-PUFM-X4
针数:4Reach Compliance Code:compliant
风险等级:5.81其他特性:AVALANCHE RATED, UL RECOGNIZED
雪崩能效等级(Eas):3000 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:900 V
最大漏极电流 (Abs) (ID):25 A最大漏极电流 (ID):25 A
最大漏源导通电阻:0.33 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PUFM-X4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):600 W最大脉冲漏极电流 (IDM):100 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Nickel (Ni)
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

IXFN25N90 数据手册

 浏览型号IXFN25N90的Datasheet PDF文件第2页浏览型号IXFN25N90的Datasheet PDF文件第3页浏览型号IXFN25N90的Datasheet PDF文件第4页 
HiPerFETTM Power MOSFETs  
Single Die MOSFET  
VDSS  
ID (cont) RDS(on)  
trr  
900 V  
900 V  
26 A 0.30 W 250 ns  
25 A 0.33 W 250 ns  
IXFN 26N90  
IXFN 25N90  
N-Channel Enhancement Mode  
D
Avalanche Rated, High dv/dt, Low trr  
G
S
Preliminary data sheet  
S
Symbol  
TestConditions  
MaximumRatings  
miniBLOC, SOT-227 B (IXFN)  
E153432  
VDSS  
VDGR  
TJ = 25°C to 150°C  
900  
900  
V
V
S
TJ = 25°C to 150°C; RGS = 1 MW  
G
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
S
ID25  
IDM  
IAR  
TC = 25°C  
26N90  
25N90  
26N90  
25N90  
26N90  
25N90  
26  
25  
104  
100  
26  
A
A
A
D
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
G = Gate  
S = Source  
D = Drain  
25  
Either Source terminal at miniBLOC can be used  
as Main or Kelvin Source  
EAR  
TC = 25°C  
TC = 25°C  
64  
3
mJ  
J
EAS  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
5
V/ns  
PD  
TC = 25°C  
600  
W
Features  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
Internationalstandardpackage  
miniBLOC, withAluminiumnitride  
isolation  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
TJM  
Tstg  
-55 ... +150  
TJ  
1.6 mm (0.63 in) from case for 10 s  
-
°C  
VISOL  
50/60 Hz, RMS  
IISOL£ 1 mA  
t = 1 min  
t = 1 s  
2500  
3000  
V~  
V~  
Low package inductance  
Fast intrinsic Rectifier  
Md  
Mountingtorque  
Terminalconnectiontorque  
1.5/13 Nm/lb.in.  
1.5/13 Nm/lb.in.  
Weight  
Symbol  
30  
g
Applications  
DC-DC converters  
Battery chargers  
Switched-modeandresonant-mode  
powersupplies  
DC choppers  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VDSS  
VGS = 0 V, ID = 3 mA  
VDS = VGS, ID = 8 mA  
900  
3.0  
V
V
VGH(th)  
5.0  
Temperatureandlightingcontrols  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±200 nA  
100 mA  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
Advantages  
2
mA  
Easy to mount  
Space savings  
High power density  
RDS(on)  
VGS  
= 10 V, ID = 0.5 • ID25  
26N90  
25N90  
0.30  
0.33  
W
W
Pulse test, t £ 300 ms, duty cycle d £ 2 %  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
97526E(10/99)  
1 - 4  

IXFN25N90 替代型号

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