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IXFN100N20 PDF预览

IXFN100N20

更新时间: 2024-11-04 22:07:55
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IXYS /
页数 文件大小 规格书
4页 115K
描述
HiPerFET Power MOSFETs

IXFN100N20 技术参数

是否无铅: 不含铅生命周期:Transferred
包装说明:FLANGE MOUNT, R-PUFM-X4针数:4
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.72其他特性:AVALANCHE RATED
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):100 A
最大漏源导通电阻:0.023 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PUFM-X4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):400 A认证状态:Not Qualified
表面贴装:NO端子面层:Nickel (Ni)
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFN100N20 数据手册

 浏览型号IXFN100N20的Datasheet PDF文件第2页浏览型号IXFN100N20的Datasheet PDF文件第3页浏览型号IXFN100N20的Datasheet PDF文件第4页 
HiPerFETTM  
Power MOSFETs  
VDSS  
ID25  
RDS(on)  
IXFK 90 N 20 200V  
90 A  
23 mW  
IXFN 100 N 20 200V 100 A 23 mW  
IXFN 106 N 20 200V 106 A 20 mW  
trr £ 200 ns  
N-Channel Enhancement Mode  
Avalanche Rated, High dv/dt, Low trr  
TO-264 AA  
(IX
Symbol  
TestConditions  
MaximumRatings  
IXFK  
IXFN  
IXFN  
90N20 100N20 106N20  
VDSS  
VDGR  
TJ = 25°C to 150°C  
200  
200  
200 V  
(TAB)  
G
TJ = 25°C to 150°C; RGS = 1 MW  
200  
200  
200 V  
D
S
VGS  
Continuous  
Transient  
±20  
±30  
±20  
±30  
20 V  
20 V  
miniBLOC, SOT-227 B (IXFN)  
VGSM  
E153432  
S
ID25  
ID80  
IDM  
IAR  
TC = 25°C, Chip capability  
TC = 80°C, limited by external leads  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
90   
76  
100  
-
106 A  
A
G
D
360  
50  
400  
50  
424 A  
A
G
S
EAR  
TC = 25°C  
30  
5
30  
5
30 mJ  
5 V/ns  
S
D
S
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
PD  
TC = 25°C  
500  
520  
W
Either Source terminal at miniBLOC can be used  
as Main or Kelvin Source  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
Features  
-55 ... +150  
l
Internationalstandardpackages  
JEDECTO-264 AA,epoxymeet  
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
-
°C  
UL94V-0,flammabilityclassification  
miniBLOCwithAluminiumnitride  
VISOL  
50/60 Hz, RMS  
IISOL £ 1 mA  
t = 1 min  
t = 1 s  
-
-
2500  
3000  
V~  
V~  
isolation  
Low RDS (on) HDMOSTM process  
Md  
Mountingtorque  
Terminalconnectiontorque  
0.9/6  
-
1.5/13 Nm/lb.in.  
1.5/13 Nm/lb.in.  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
Fast intrinsic Rectifier  
Weight  
10  
30  
g
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
Applications  
DC-DC converters  
Synchronousrectification  
Battery chargers  
min. typ. max.  
VDSS  
VGS = 0 V, ID = 1 mA  
VDS = VGS, ID = 8 mA  
200  
2
V
V
Switched-modeandresonant-mode  
VGH(th)  
4
powersupplies  
DC choppers  
Temperatureandlightingcontrols  
Low voltage relays  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±200 nA  
400 mA  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
2
mA  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t £ 300 ms,  
duty cycle d £ 2 %  
Advantages  
IXFK90N20  
IXFN100N20  
IXFN106N20  
0.023  
0.023  
0.020  
W
W
W
Easy to mount  
Space savings  
High power density  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
92804H(7/97)  
1 - 4  

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