HiPerFETTM
Power MOSFETs
Q-Class
IXFH 14N100Q
IXFK 14N100Q
IXFT 14N100Q
VDSS
ID25
= 1000 V
14 A
=
RDS(on) = 0.75 Ω
t ≤ 250 ns
N-ChannelEnhancementMode
rr
AvalancheRated, LowQg,Highdv/dt
Preliminarydatasheet
TO-247 AD (IXFH)
Symbol
TestConditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
1000
1000
V
V
(TAB)
VGS
VGSM
Continuous
Transient
±20
±30
V
V
ID25
IDM
IAR
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
14
56
14
A
A
A
TO-268 (D3) ( IXFT)
G
EAR
EAS
TC = 25°C
TC = 25°C
45
1.5
mJ
J
S
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
,
5
V/ns
TJ ≤ 150°C, RG = 2 Ω
TO-264 AA (IXFK)
PD
TC = 25°C
360
W
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
G
D
S
D (TAB)
TL
1.6 mm (0.063 in) from case for 10 s
Mounting torque
300
°C
G = Gate
S = Source
Md
TO-247
TO-264
1.13/10 Nm/lb.in.
0.9/6 Nm/lb.in.
TAB = Drain
Weight
Symbol
TO-247
TO-268
TO-264
6
4
10
g
g
g
Features
l
IXYS advanced low Qg process
International standard packages
Epoxy meet UL 94 V-0, flammability
classification
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
l
l
min. typ. max.
l
l
l
Low RDS (on) low Qg
Avalanche energy and current rated
Fast intrinsic rectifier
VDSS
VGS = 0 V, ID = 250 µA
1000
3.0
V
V
VGS(th)
VDS = VGS, ID = 4 mA
5.0
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
±200 nA
50 µA
Advantages
VDS = VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
2
mA
l
Easy to mount
RDS(on)
VGS = 10 V, ID = 0.5 ID25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
0.75
Ω
l
Space savings
l
High power density
© 2001 IXYS All rights reserved
98858 (9/01)