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IXFC52N30P PDF预览

IXFC52N30P

更新时间: 2024-11-06 21:55:19
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IXYS /
页数 文件大小 规格书
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描述
PolarHTTM HiPerFET Power MOSFET

IXFC52N30P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Lifetime Buy包装说明:PLASTIC, ISOPLUS220, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.74
其他特性:AVALANCHE RATED, UL RECOGNIZED雪崩能效等级(Eas):1000 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (ID):24 A
最大漏源导通电阻:0.075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):150 A
认证状态:Not Qualified表面贴装:NO
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFC52N30P 数据手册

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Advance Technical Information  
PolarHTTM  
HiPerFET  
Power MOSFET  
IXFC52N30P  
VDSS  
ID25  
= 300 V  
= 32 A  
RDS(on) = 75 mΩ  
N-Channel Enhancement Mode  
ISOPLUS220TM(IXFC)  
E153432  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
300  
300  
V
V
VGSS  
VGSM  
Continuous  
Transient  
20  
30  
V
V
G
D
S
ID25  
IDM  
TC = 25°C  
32  
A
A
TC = 25°C, pulse width limited by TJM  
150  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
IAR  
TC = 25°C  
52  
A
EAR  
EAS  
TC = 25°C  
TC = 25°C  
30  
mJ  
J
1.0  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 4 Ω  
,
10  
V/ns  
TC = 25°C  
100  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
Features  
z Silicon chip on Direct-Copper-Bond  
substrate  
TL  
VISOL  
1.6 mm (0.062 in.) from case for 10 s  
50/60 Hz, RMS, t = 1minute, leads-to-tab  
300  
2500  
°C  
V~  
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
z Low drain to tab capacitance(<30pF)  
FC  
Mounting Force  
11..65/2.5..15  
2.0  
N/lb  
g
Weight  
ISOPLUS220  
Advantages  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
z
Easy to mount  
Space savings  
High power density  
z
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 4 mA  
VGS = 20 VDC, VDS = 0  
300  
V
V
z
2.5  
5.0  
100  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
250  
µA  
µA  
TJ = 125°C  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
65  
75 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
DS99115A(04/05)  
© 2003 IXYS All rights reserved  

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