HiPerFETTM
Power MOSFETs
VDSS = 500V
IXFB80N50Q2
ID25
R
=
≤
80A
60mΩ
trrDS(on) ≤ 250ns
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, Low Intrinsic RG
High dV/dt, Low trr
PLUS264TM( IXFB)
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
500
500
V
V
VGSS
VGSM
Continuous
Transient
± 30
± 40
V
V
G
D
S
( TAB )
ID25
IDRMS
IDM
TC = 25°C
80
75
320
A
A
A
External lead limited
TC = 25°C, pulse width limited by TJM
G = Gate
D = Drain
TAB = Drain
S = Source
IAR
EAR
EAS
TC = 25°C
TC = 25°C
TC = 25°C
80
60
5.0
A
mJ
J
Features
z Double metal process for low gate
resistance
dV/dt
PD
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
20
960
V/ns
W
z Unclamped Inductive Switching (UIS)
rated
TJ
-55 ... +150
°C
z Low package inductance
- easy to drive and to protect
z Fast intrinsic rectifier
TJM
Tstg
150
-55 ... +150
°C
°C
TL
TSOLD
1.6 mm (0.063 in.) from case for 10s
Plastic body for 10s
300
260
°C
°C
Applications
z
FC
Mounting force
30...120/6.7...27
10
N / lbs
g
DC-DC converters
Switched-mode and resonant-mode
power supplies, >500kHz switching
DC choppers
z
Weight
z
z Pulse generation
z Laser drivers
Symbol
Test Conditions
Characteristic Values
Advantages
(TJ = 25°C, unless otherwise specified)
Min.
Typ. Max.
z
PLUS 264TM package for clip or spring
BVDSS
VGS(th)
IGSS
VGS = 0 V, ID = 1mA
VDS = VGS, ID = 8mA
VGS = ±30 V, VDS = 0V
500
V
V
mounting
Space savings
High power density
z
3.0
5.5
z
± 200 nA
100 μA
IDSS
VDS = VDSS
VGS = 0V
TJ = 125°C
5
mA
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
60 mΩ
DS98958F(07/07)
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