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IXFB60N80P PDF预览

IXFB60N80P

更新时间: 2024-11-21 14:56:43
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
5页 234K
描述
功能与特色: 优点: 应用:

IXFB60N80P 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:IN-LINE, R-PSIP-T3Reach Compliance Code:compliant
风险等级:5.72其他特性:AVALANCHE RATED
雪崩能效等级(Eas):5000 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:800 V
最大漏极电流 (ID):60 A最大漏源导通电阻:0.14 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):150 A认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFB60N80P 数据手册

 浏览型号IXFB60N80P的Datasheet PDF文件第2页浏览型号IXFB60N80P的Datasheet PDF文件第3页浏览型号IXFB60N80P的Datasheet PDF文件第4页浏览型号IXFB60N80P的Datasheet PDF文件第5页 
PolarHVTM HiPerFET  
Power MOSFET  
IXFB 60N80P  
VDSS = 800 V  
ID25 60 A  
RDS(on) 140 mΩ  
250 ns  
=
N-Channel Enhancement Mode  
Avalanche Rated  
trr  
Fast Intrinsic Diode  
Symbol  
Test Conditions  
Maximum Ratings  
PLUS264TM (IXFB)  
VDSS  
VDGR  
TJ = 25° C to 150° C  
800  
800  
V
V
TJ = 25° C to 150° C; RGS = 1 MΩ  
VGSS  
VGSM  
Continuous  
Transient  
30  
40  
V
V
(TAB)  
G
D
S
ID25  
IDM  
TC =25° C  
60  
A
A
TC = 25° C, pulse width limited by TJM  
150  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
IAR  
TC =25° C  
30  
A
EAR  
EAS  
TC =25° C  
TC =25° C  
100  
5
mJ  
J
Features  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150° C, RG = 2 Ω  
,
20  
V/ns  
l
International standard packages  
Fast recovery diode  
Unclamped Inductive Switching (UIS)  
rated  
l
l
TC =25° C  
1250  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
l
Low package inductance  
- easy to drive and to protect  
TL  
TSOLD  
1.6 mm (0.062 in.) from case for 10 s  
Plastic body for 10 s  
300  
260  
°C  
°C  
Advantages  
FC  
Mounting force  
30..120/7.5...2.7  
10  
N/lb  
g
l
Plus 264TM package for clip or spring  
Space savings  
Weight  
l
l
High power density  
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25° C, unless otherwise specified)  
Min. Typ.  
Max.  
BVDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 3 mA  
VDS = VGS, ID = 8 mA  
VGS = 30 VDC, VDS = 0  
800  
V
V
3.0  
5.0  
200  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
3000  
µA  
µA  
TJ = 125° C  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25, Note 1  
140 mΩ  
DS99560E(02/06)  
© 2006 IXYS All rights reserved  

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