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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| IT3D-300S-BGA37 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-300S-BGA57 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-17H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-20H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-22H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-25H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-26H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-28H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-30H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3M-100P-32H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
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联发科推出全球首款3纳米汽车芯片CT-X1，挑战高通SA8295
国家大基金减持三家半导体企业，市场反应各异
晶圆厂易主：Coherent公司2000万英镑出售苹果供应链关键资产
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