Datasheet > ISPLSI3160-70LB272

ISPLSI3160-70LB272

更新时间： 2024-10-28 23:59:51

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
15页	187K
描述

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ISPLSI3160-70LB272 数据手册

浏览型号ISPLSI3160-70LB272的Datasheet PDF文件第2页

浏览型号ISPLSI3160-70LB272的Datasheet PDF文件第3页

浏览型号ISPLSI3160-70LB272的Datasheet PDF文件第4页

浏览型号ISPLSI3160-70LB272的Datasheet PDF文件第5页

浏览型号ISPLSI3160-70LB272的Datasheet PDF文件第6页

ispLSI 3160

In-System Programmable High Density PLD

Features

Functional Block Diagram

• HIGH-DENSITY PROGRAMMABLE LOGIC

— 160 I/O Pins

— 7000 PLD Gates

ISP and

Boundary

Scan TAP

ORP

— 320 Registers

— High Speed Global Interconnect

— Wide Input Gating for Fast Counters, State

Machines, Address Decoders, etc.

— Small Logic Block Size for Random Logic

Array

• HIGH PERFORMANCE E²CMOS^®TECHNOLOGY

— fmax = 125 MHz Maximum Operating Frequency

— tpd = 7.5 ns Propagation Delay

Twin

GLB

Array

— TTL Compatible Inputs and Outputs

— Electrically Erasable and Reprogrammable

— Non-Volatile

— 100% Tested at Time of Manufacture

— Unused Product Term Shutdown Saves Power

Global Routing Pool

(GRP)

• IN-SYSTEM PROGRAMMABLE

— 5V In-System Programmability (ISP™) Using

Lattice ISP or Boundary Scan Test (IEEE 1149.1)

Protocol

— Increased Manufacturing Yields, Reduced Time-to-

Market, and Improved Product Quality

— Reprogram Soldered Devices for Faster Debugging

• 100% IEEE 1149.1 BOUNDARY SCAN COMPATIBLE

Description

• OFFERS THE EASE OF USE AND FAST SYSTEM

SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY

OF FIELD PROGRAMMABLE GATE ARRAYS

— Complete Programmable Device Can Combine Glue

Logic and Structured Designs

The ispLSI 3160 is a High-Density Programmable Logic

Devices containing 320 Registers, 160 Universal I/O

pins, fiveDedicatedClockInputPins, fiveOutputRouting

Pools (ORP) and a Global Routing Pool (GRP) which

allows complete inter-connectivity between all of these

elements. The ispLSI 3160 features 5V in-system pro-

grammability and in-system diagnostic capabilities. The

ispLSI 3160 offers non-volatile reprogrammability of the

logic, as well as the interconnect to provide truly

reconfigurable systems.

— Five Dedicated Clock Input Pins

— Synchronous and Asynchronous Clocks

— Programmable Output Slew Rate Control to Mini-

mize Switching Noise

— Flexible Pin Placement

— Optimized Global Routing Pool Provides Global

Interconnectivity

The basic unit of logic on the ispLSI 3160 device is the

TwinGenericLogicBlock(TwinGLB)labelledA0,A1...E3.

There are a total of 20 of these Twin GLBs in the ispLSI

3160 device. Each Twin GLB has 24 inputs, a program-

mable AND array and two OR/Exclusive-OR Arrays, and

eight outputs which can be configured to be either com-

binatorial or registered. All Twin GLB inputs come from

the GRP.

• ispDesignEXPERT™ – LOGIC COMPILER AND COM-

PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL

SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING

— Superior Quality of Results

— Tightly Integrated with Leading CAE Vendor Tools

— Productivity Enhancing Timing Analyzer, Explore

Tools, Timing Simulator and ispANALYZER™

— PC and UNIX Platforms

to change without notice.

LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.

Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com

May 1999

3160_08

12 3 4 5 6 7...15

中文翻译

下载PDF

与ISPLSI3160-70LB272相关器件

型号	品牌	获取价格	描述	数据表
ISPLSI3160-70LM	ETC	获取价格	Electrically-Erasable Complex PLD
ISPLSI3160-70LQ	ETC	获取价格
ISPLSI3192	LATTICE	获取价格	High Density Programmable Logic
ISPLSI3192-100LB272	LATTICE	获取价格	High Density Programmable Logic
ISPLSI3192-100LB272I	LATTICE	获取价格	High Density Programmable Logic
ISPLSI3192-100LM	ETC	获取价格	Electrically-Erasable Complex PLD
ISPLSI3192-100LQ	LATTICE	获取价格	High Density Programmable Logic
ISPLSI3192-100LQI	LATTICE	获取价格	High Density Programmable Logic
ISPLSI3192-70LB	LATTICE	获取价格	EE PLD, 18ns, CMOS, PBGA272, 27 X 27 MM, BGA-272
ISPLSI3192-70LB272	LATTICE	获取价格	High Density Programmable Logic

与ISPLSI3160-70LB272相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

15
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

18
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

42
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

49

产品中心

服务支持

精选活动

关于我们

帮助中心

ISPLSI3160-70LB272

ISPLSI3160-70LB272 数据手册

与ISPLSI3160-70LB272相关器件

与ISPLSI3160-70LB272相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ISPLSI3160-70LB272

ISPLSI3160-70LB272 数据手册

与ISPLSI3160-70LB272相关器件

与ISPLSI3160-70LB272相关文章

您还可以找

您在本页遇到什么问题？