ISO6731-Q1
SLASEZ0 – IJSAONU6A7R3Y12-Q0211
SLASEZ0 – JANUARY 2021
www.ti.com
ISO6731-Q1 General-Purpose Triple-Channel Automotive Digital Isolator with Robust
EMC
1 Features
3 Description
•
AEC-Q100 qualified with the following results:
– Device temperature Grade 1: –40°C to +125°C
ambient operating temperature range
Meets VDA320 isolation requirements
50 Mbps data rate
The ISO6731-Q1 device is a high-performance, triple-
channel digital isolators ideal for cost-sensitive
applications requiring up to 5000 VRMS isolation
ratings per UL 1577. This device is also certified by
VDE, TUV, CSA, and CQC.
•
•
•
Robust isolation barrier:
The
ISO6731-Q1
devics
provides
high
electromagnetic immunity and low emissions at low
power consumption, while isolating CMOS or
LVCMOS digital I/Os. Each isolation channel has a
logic input and output buffer separated by TI's double
capacitive silicon dioxide (SiO2) insulation barrier.
This device comes with enable pins which can be
used to put the respective outputs in high impedance
for multi-master driving applications. The ISO6731-Q1
device has two forward and one reverse-direction
channels. In the event of input power or signal loss,
the default output is high for the device without suffix
F and low for the device with suffix F. See Device
Functional Modes section for further details.
– High lifetime at 1060 VRMS working voltage
– Up to 5000 VRMS isolation rating
– Up to 10 kV surge capability
– ±75 kV/μs typical CMTI
Wide supply range: 1.71 V to 1.89 V and 2.25 V to
5.5 V
1.71 V to 5.5 V level translation
Default output high (ISO6731-Q1) and low
(ISO6731F-Q1) options
1.6 mA per channel typical at 1 Mbps
Low propagation delay: 11 ns typical
Robust electromagnetic compatibility (EMC)
– System-level ESD, EFT, and surge immunity
– ±8 kV IEC 61000-4-2 contact discharge
protection across isolation barrier
– Low emissions
•
•
•
•
•
•
Used in conjunction with isolated power supplies, this
device helps prevent noise currents on data buses,
such as CAN and LIN from damaging sensitive
circuitry. Through innovative chip design and layout
techniques, the electromagnetic compatibility of the
ISO6731-Q1 device has been significantly enhanced
to ease system-level ESD, EFT, surge, and emissions
compliance. The ISO6731-Q1 device is available in a
16-pin SOIC wide-body (DW) package and is a pin-to-
pin upgrade to the older generations.
•
•
Wide-SOIC (DW-16) Package
Safety-Related Certifications (pending):
– DIN V VDE 0884-11:2017-01
– UL 1577 component recognition program
– IEC 60950-1, IEC 62368-1, IEC 61010-1,
IEC60601-1 and GB 4943.1-2011 certifications
Device Information
PACKAGE
2 Applications
PART NUMBER (1)
BODY SIZE (NOM)
ISO6731-Q1,
ISO6731F-Q1
SOIC (DW)
10.30 mm × 7.50
mm
•
Hybrid, electric and power train system (EV/HEV)
– Battery management system (BMS)
– On-board charger
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
– Traction inverter
– DC/DC converter
– Inverter and motor control
VCCO
VCCI
Series Isolation
Capacitors
INx
OUTx
ENx
GNDI
GNDO
Copyright © 2016, Texas Instruments Incorporated
VCCI=Input supply, VCCO=Output supply
GNDI=Input ground, GNDO=Output ground
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
Product Folder Links: ISO6731-Q1
1
without notice.