生命周期: | Unknown | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 24 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.66 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PQCC-N24 |
JESD-609代码: | e3 | 长度: | 4 mm |
湿度敏感等级: | 3 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 24 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 1 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 4 mm | Base Number Matches: | 1 |
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ISL28025FI60Z-T7A | RENESAS |
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