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IS64WV10248BLL-10MA3 PDF预览

IS64WV10248BLL-10MA3

更新时间: 2024-11-05 12:04:03
品牌 Logo 应用领域
美国芯成 - ISSI 存储内存集成电路静态存储器
页数 文件大小 规格书
20页 198K
描述
1M x 8 HIGH-SPEED CMOS STATIC RAM

IS64WV10248BLL-10MA3 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:BGA
包装说明:TFBGA, BGA48,6X8,32针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.81
Is Samacsys:N最长访问时间:10 ns
I/O 类型:COMMONJESD-30 代码:R-PBGA-B48
JESD-609代码:e0长度:11 mm
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-40 °C组织:1MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3 V认证状态:Not Qualified
筛选级别:AEC-Q100座面最大高度:1.2 mm
最大待机电流:0.07 A最小待机电流:1.2 V
子类别:SRAMs最大压摆率:0.14 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.4 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:9 mm
Base Number Matches:1

IS64WV10248BLL-10MA3 数据手册

 浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第2页浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第3页浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第4页浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第5页浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第6页浏览型号IS64WV10248BLL-10MA3的Datasheet PDF文件第7页 
IS61WV10248ALL  
IS61WV10248BLL  
IS64WV10248BLL  
JUNE2008  
1M x 8 HIGH-SPEED CMOS STATIC RAM  
FEATURES  
DESCRIPTION  
• High-speed access times:  
8, 10, 20 ns  
• High-performance, low-power CMOS process  
• Multiple center power and ground pins for  
greater noise immunity  
• Easy memory expansion with CE and OE  
TheISSIIS61WV10248ALL/BLLandIS64WV10248BLL  
are very high-speed, low power, 1M-word by 8-bit CMOS  
static RAM. The IS61WV10248ALL/BLL and  
IS64WV10248BLLarefabricatedusingISSI'shigh-  
performance CMOS technology. This highly reliable  
process coupled with innovative circuit design tech-  
niques, yields higher performance and low power con-  
sumption devices.  
options  
CE power-down  
• Fully static operation: no clock or refresh  
required  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down with CMOS input levels.  
• TTL compatible inputs and outputs  
• Single power supply  
TheIS61WV10248ALL/BLLandIS64WV10248BLL  
operate from a single power supply and all inputs are  
TTL-compatible.  
– VDD 1.65V to 2.2V (IS61WV10248ALL)  
speed = 20ns for Vcc = 1.65V to 2.2V  
– VDD 2.4V to 3.6V (IS61/64WV10248BLL)  
speed = 10ns for Vcc = 2.4V to 3.6V  
speed = 8ns for Vcc = 3.3V + 5%  
• Packages available:  
TheIS61WV10248ALL/BLLandIS64WV10248BLLare  
available in 48 ball mini BGA and 44-pin TSOP (Type II)  
packages.  
48-ball miniBGA (9mm x 11mm)  
– 44-pin TSOP (Type II)  
• Industrial and Automotive Temperature Support  
• Lead-free available  
FUNCTIONAL BLOCK DIAGRAM  
1M X 8  
MEMORY ARRAY  
A0-A19  
DECODER  
VDD  
GND  
I/O  
DATA  
COLUMN I/O  
I/O0-I/O7  
CIRCUIT  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
1
Rev. B  
06/03/08  

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