IS62WV102416ALL
IS62WV102416BLL
IS65WV102416BLL
1M x 16 HIGH-SPEED LOW POWER
ASYNCHRONOUS CMOS STATIC RAM
JANUARY2008
FEATURES
• High-speed access times:
25, 35 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
DESCRIPTION
TheISSIIS62WV102416ALL/BLLandIS65WV102416BLL
are high-speed, 16M-bit static RAMs organized as 1024K
wordsby16bits. ItisfabricatedusingISSI'shigh-perform-
anceCMOStechnology.Thishighlyreliableprocesscoupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
• Easy memory expansion with CS1 and OE
options
• CS1 power-down
• Fully static operation: no clock or refresh
required
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselected) or when CS1 is LOW, CS2 is HIGH and both
LBandUBareHIGH, thedeviceassumesastandbymode
at which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory. A
data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
• TTL compatible inputs and outputs
• Single power supply
VDD 1.65V to 2.2V (IS62WV102416ALL)
speed = 35ns for VDD 1.65V to 2.2V
VDD 2.4V to 3.6V (IS62/65WV102416BLL)
speed = 25ns for VDD 2.4V to 3.6V
• Packages available:
The device is packaged in the JEDEC standard 48-pin
TSOP Type I and 48-pin Mini BGA (9mm x 11mm).
–
48-ball miniBGA (9mm x 11mm)
– 48-pin TSOP (Type I)
• Industrial and Automotive Temperature Support
• Lead-free available
• Data control for upper and lower bytes
FUNCTIONAL BLOCK DIAGRAM
1024K x 16
MEMORY ARRAY
A0-A19
DECODER
VDD
GND
I/O0-I/O7
Lower Byte
I/O
DATA
COLUMN I/O
CIRCUIT
I/O8-I/O15
Upper Byte
CS1
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. A
01/18/08