是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LQFP, QFP100,.63X.87 | Reach Compliance Code: | compliant |
风险等级: | 5.47 | 最长访问时间: | 2.6 ns |
最大时钟频率 (fCLK): | 250 MHz | I/O 类型: | COMMON |
JESD-30 代码: | R-PQFP-G100 | 长度: | 20 mm |
内存密度: | 18874368 bit | 内存集成电路类型: | ZBT SRAM |
内存宽度: | 36 | 功能数量: | 1 |
端子数量: | 100 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 512KX36 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LQFP |
封装等效代码: | QFP100,.63X.87 | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK, LOW PROFILE | 并行/串行: | PARALLEL |
电源: | 2.5/3.3,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 最大待机电流: | 0.06 A |
最小待机电流: | 3.14 V | 子类别: | SRAMs |
最大压摆率: | 0.45 mA | 最大供电电压 (Vsup): | 3.465 V |
最小供电电压 (Vsup): | 3.135 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | QUAD |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS61NLP51236-250TQLI | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM | |
IS61NLP51236B-200B2 | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028, BGA-119 | |
IS61NLP51236B-200B2L | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-11 | |
IS61NLP51236B-200B2LI | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-11 | |
IS61NLP51236B-200B3 | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 | |
IS61NLP51236B-200B3A3 | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, TFBGA-165 | |
IS61NLP51236B-200B3LI | ISSI |
获取价格 |
IC SRAM 18M PARALLEL 165TFBGA | |
IS61NLP51236B-200B3LI-TR | ISSI |
获取价格 |
IC SRAM 18M PARALLEL 165TFBGA | |
IS61NLP51236B-200TQLA3 | ISSI |
获取价格 |
Standard SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, QFP-100 | |
IS61NLP51236B-200TQLI | ISSI |
获取价格 |
IC SRAM 18M PARALLEL 100LQFP |