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IS61LPD102418-250B3I PDF预览

IS61LPD102418-250B3I

更新时间: 2024-11-12 10:12:39
品牌 Logo 应用领域
美国芯成 - ISSI 静态存储器
页数 文件大小 规格书
29页 159K
描述
Cache SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165

IS61LPD102418-250B3I 数据手册

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®
IS61VPD51236A IS61VPD102418A  
IS61LPD51236A IS61LPD102418A  
ISSI  
512K x 36, 1024K x 18  
18Mb SYNCHRONOUS PIPELINED,  
DOUBLE CYCLE DESELECT STATIC RAM  
ADVANCE INFORMATION  
DECEMBER 2002  
DESCRIPTION  
FEATURES  
The ISSI IS61LPD/VPD51236A and IS61LPD/  
VPD102418A are high-speed, low-power synchronous  
static RAMs designed to provide burstable, high-performance  
memory for communication and networking applications.  
TheIS61LPD/VPD51236Aisorganizedas524,288words  
by 36 bits, and the IS61LPD/VPD102418A is organized as  
1,048,576 words by 18 bits. Fabricated with ISSI's ad-  
vanced CMOS technology, the device integrates a 2-bit  
burst counter, high-speed SRAM core, and high-drive  
capability outputs into a single monolithic circuit. All  
synchronous inputs pass through registers controlled by  
a positive-edge-triggered single clock input.  
• Internal self-timed write cycle  
• Individual Byte Write Control and Global Write  
• Clock controlled, registered address, data and  
control  
• Burst sequence control using MODE input  
• Three chip enable option for simple depth  
expansion and address pipelining  
• Common data inputs and data outputs  
• Auto Power-down during deselect  
• Double cycle deselect  
Write cycles are internally self-timed and are initiated by  
the rising edge of the clock input. Write cycles can be one  
to four bytes wide as controlled by the write control inputs.  
• Snooze MODE for reduced-power standby  
• JTAG Boundary Scan for PBGA package  
• Power Supply  
Separate byte enables allow individual bytes to be written.  
The byte write operation is performed by using the byte  
write enable (BWE) input combined with one or more  
individual byte write signals (BWx). In addition, Global  
Write (GW) is available for writing all bytes at one time,  
regardless of the byte write controls.  
LPD: VDD 3.3V + 5%, VDDQ 3.3V/2.5V + 5%  
VPD: VDD 2.5V + 5%, VDDQ 2.5V + 5%  
Bursts can be initiated with either ADSP (Address Status  
Processor) or ADSC (Address Status Cache Controller)  
input pins. Subsequent burst addresses can be generated  
internally and controlled by the ADV (burst address  
advance) input pin.  
• JEDEC 100-Pin TQFP,  
119-pin PBGA, and 165-pin PBGA package  
The mode pin is used to select the burst sequence order,  
Linear burst is achieved when this pin is tied LOW.  
Interleave burst is achieved when this pin is tied HIGH or  
left floating.  
FAST ACCESS TIME  
Symbol  
tKQ  
Parameter  
250  
2.6  
4
200  
3.1  
5
Units  
ns  
Clock Access Time  
Cycle Time  
tKC  
ns  
Frequency  
250  
200  
MHz  
This document contains ADVANCE INFORMATION data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best  
possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCEINFORMATION Rev. 00A  
1
12/17/02  

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