IS43/46TR16128B, IS43/46TR16128BL,
IS43/46TR82560B, IS43/46TR82560BL
256Mx8, 128Mx16 2Gb DDR3 SDRAM
AUGUST 2014
FEATURES
Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
- Backward compatible to 1.5V
Partial Array Self Refresh
High speed data transfer rates with system
frequency up to 1066 MHz
Asynchronous RESET pin
8 internal banks for concurrent operation
8n-Bit pre-fetch architecture
TDQS (Termination Data Strobe) supported (x8
only)
OCD (Off-Chip Driver Impedance Adjustment)
Dynamic ODT (On-Die Termination)
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
Write Leveling
Programmable CAS Latency
Programmable Additive Latency: 0, CL-1,CL-2
Programmable CAS WRITE latency (CWL) based
on tCK
Programmable Burst Length: 4 and 8
Operating temperature:
Programmable Burst Sequence: Sequential or
Interleave
Commercial (TC = 0°C to +95°C)
Industrial (TC = -40°C to +95°C)
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)
BL switch on the fly
Auto Self Refresh(ASR)
Self Refresh Temperature(SRT)
ADDRESS TABLE
Parameter
OPTIONS
256Mx8
A0-A14
A0-A9
BA0-2
1KB
128Mx16
A0-A13
A0-A9
BA0-2
2KB
Configuration:
Row Addressing
Column Addressing
Bank Addressing
256Mx8
128Mx16
Package:
Page size
Auto Precharge
Addressing
96-ball FBGA (9mm x 13mm) for x16
78-ball FBGA (8mm x 10.5mm) for x8
A10/AP
A10/AP
BL switch on the fly
A12/BC#
A12/BC#
SPEED BIN
Speed Option
15H
125K
107M
093N
Units
JEDEC Speed Grade
DDR3-1333H
DDR3-1600K
DDR3-1866M
DDR3-2133N
CL-nRCD-nRP
tRCD,tRP(min)
9-9-9
13.5
11-11-11
13.75
13-13-13
13.91
14-14-14
13.09
tCK
ns
Note: Faster speed options are backward compatible to slower speed options.
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. B
08/25/2014