IS43/46TR16640ED
IS43/46TR81280ED
128MX8, 64MX16 1Gb DDR3 SDRAM WITH ECC
Preliminary Information
AUGUST 2016
FEATURES
Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
Refresh Interval:
7.8 μs (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 μs (8192 cycles/32 ms) Tc= 85°C to 105°C
1.95 μs (8192 cycles/16ms)Tc=105°C to 125°C
High speed data transfer rates with system
frequency up to 800 MHz
8 internal banks for concurrent operation
8n-bit pre-fetch architecture
Partial Array Self Refresh
Asynchronous RESET pin
Programmable CAS Latency
TDQS (Termination Data Strobe) supported (x8
only)
Programmable Additive Latency: 0, CL-1,CL-2
Programmable CAS WRITE latency (CWL) based
on tCK
OCD (Off-Chip Driver Impedance Adjustment)
Dynamic ODT (On-Die Termination)
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 )
Write Leveling
Programmable Burst Length: 4 and 8
Programmable Burst Sequence: Sequential or
Interleave
BL switch on the fly
Operating temperature:
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)
Automotive, A3 (TC= -40°C to +125°C)
Auto Self Refresh(ASR)
Self Refresh Temperature(SRT)
ECC
Single bit error correction (per 64-bits)
ADDRESS TABLE
Parameter
Restrictions on Burst Length and Data Mask
128Mx8
A0-A13
A0-A9
64Mx16
A0-A12
A0-A9
Row Addressing
Column Addressing
Bank Addressing
Page size
OPTIONS
Configuration:
BA0-2
BA0-2
128Mx8
64Mx16
1KB
2KB
Auto Precharge Addressing
BL switch on the fly
A10/AP
A12/BC#
A10/AP
A12/BC#
Package:
96-ball FBGA (9mm x 13mm) for x16
78-ball FBGA (8mm x 10.5mm) for x8
SPEED BIN
Speed Option
15H
125K
Units
JEDEC Speed Grade
DDR3-1333H
DDR3-1600K
CL-nRCD-nRP
tRCD,tRP(min)
9-9-9
13.5
11-11-11
13.75
tCK
ns
Note: Faster speed options may be backward compatible to slower speed options. Refer to timing tables (8.3)
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. 0B
08/08/2016