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IS46TR16640A-187FBLA2 PDF预览

IS46TR16640A-187FBLA2

更新时间： 2024-10-28 20:03:59
品牌 Logo 应用领域
美国芯成 - ISSI 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
81页 3422K
描述
DDR DRAM, 64MX16, 13.125ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-96

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IS46TR16640A-187FBLA2 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：TFBGA, BGA96,9X16,32
针数：96Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.32.00.32
风险等级：5.84访问模式：MULTI BANK PAGE BURST
最长访问时间：13.125 ns其他特性：AUTO SELF REFRESH MODE, ALSO OPERATES AT 1.35 V NOMINAL SUPPLY
最大时钟频率 (fCLK)：533 MHzI/O 类型：COMMON
交错的突发长度：4,8JESD-30 代码：R-PBGA-B96
长度：13 mm内存密度：1073741824 bit
内存集成电路类型：DDR DRAM内存宽度：16
功能数量：1端口数量：1
端子数量：96字数：67108864 words
字数代码：64000000工作模式：SYNCHRONOUS
最高工作温度：105 °C最低工作温度：-40 °C
组织：64MX16输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：TFBGA
封装等效代码：BGA96,9X16,32封装形状：RECTANGULAR
封装形式：GRID ARRAY, THIN PROFILE, FINE PITCH电源：1.5 V
认证状态：Not Qualified刷新周期：8192
筛选级别：AEC-Q100座面最大高度：1.2 mm
自我刷新：YES连续突发长度：4,8
最大待机电流：0.015 A子类别：DRAMs
最大压摆率：0.27 mA最大供电电压 (Vsup)：1.575 V
最小供电电压 (Vsup)：1.425 V标称供电电压 (Vsup)：1.5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
宽度：9 mmBase Number Matches：1

IS46TR16640A-187FBLA2 数据手册

 浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第2页浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第3页浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第4页浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第5页浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第6页浏览型号IS46TR16640A-187FBLA2的Datasheet PDF文件第7页 
IS43/46TR16640A, IS43/46TR16640AL  
IS43/46TR81280A, IS43/46TR81280AL  
128MX8, 64MX16 1Gb DDR3 SDRAM  
NOVEMBER 2013  
FEATURES  
Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V  
Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V  
Refresh Interval:  
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C  
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C  
High speed data transfer rates with system  
frequency up to 800 MHz  
Partial Array Self Refresh  
8 internal banks for concurrent operation  
8n-bit pre-fetch architecture  
Asynchronous RESET pin  
TDQS (Termination Data Strobe) supported (x8  
only)  
Programmable CAS Latency  
Programmable Additive Latency: 0, CL-1,CL-2  
OCD (Off-Chip Driver Impedance Adjustment)  
Dynamic ODT (On-Die Termination)  
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 )  
Write Leveling  
Programmable CAS WRITE latency (CWL) based  
on tCK  
Programmable Burst Length: 4 and 8  
Programmable Burst Sequence: Sequential or  
Interleave  
Operating temperature:  
Commercial (TC = 0°C to +95°C)  
Industrial (TC = -40°C to +95°C)  
Automotive, A1 (TC = -40°C to +95°C)  
Automotive, A2 (TC = -40°C to +105°C)  
BL switch on the fly  
Auto Self Refresh(ASR)  
Self Refresh Temperature(SRT)  
OPTIONS  
ADDRESS TABLE  
Parameter  
Row Addressing  
Column Addressing  
Bank Addressing  
Page size  
Configuration:  
128Mx8  
64Mx16  
128Mx8  
A0-A13  
A0-A9  
64Mx16  
A0-A12  
A0-A9  
Package:  
96-ball FBGA (9mm x 13mm) for x16  
78-ball FBGA (8mm x 10.5mm) for x8  
BA0-2  
1KB  
BA0-2  
2KB  
Auto Precharge Addressing  
BL switch on the fly  
A10/AP  
A12/BC#  
A10/AP  
A12/BC#  
SPEED BIN  
Speed Option  
187F  
15G  
15H  
125J  
Units  
JEDEC Speed Grade  
DDR3-1066F  
DDR3-1333G  
DDR3-1333H  
DDR3-1600J  
CL-nRCD-nRP  
tRCD,tRP(min)  
7-7-7  
13.125  
8-8-8  
12.0  
9-9-9  
13.125  
10-10-10  
12.5  
tCK  
ns  
Note: Faster speed options may be backward compatible to slower speed options. Refer to timing specifications (8.3)  
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised  
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product  
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use  
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc. – www.issi.com –  
1
Rev. E  
10/29/2013  
1234567...81

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