IS43/46DR81280B/L, IS43/46DR16640B/L
PRELMINARY INFORMATION
AUGUST 2012
1Gb (x8, x16) DDR2 SDRAM
FEATURES
Clock frequency up to 400MHz
8 internal banks for concurrent operation
4‐bit prefetch architecture
Programmable CAS Latency: 3, 4, 5, 6 and 7
Programmable Additive Latency: 0, 1, 2, 3, 4, 5
and 6
Bidirectional differential Data Strobe (Single‐
ended data‐strobe is an optional feature)
On‐Chip DLL aligns DQ and DQs transitions with
CK transitions
DQS# can be disabled for single‐ended data
strobe
Read Data Strobe supported (x8 only)
Differential clock inputs CK and CK#
VDD and VDDQ = 1.8V ± 0.1V
PASR (Partial Array Self Refresh)
SSTL_18 interface
tRAS lockout supported
Operating temperature:
Commercial (TA = 0°C to 70°C ; TC = 0°C to 85°C)
Industrial (TA = ‐40°C to 85°C; TC = ‐40°C to 95°C)
Automotive, A1 (TA = ‐40°C to 85°C; TC = ‐40°C to 95°C)
Automotive, A2 (TA = ‐40°C to 105°C; TC = ‐40°C to
105°C)
Write Latency = Read Latency‐1
Programmable Burst Sequence: Sequential or
Interleave
Programmable Burst Length: 4 and 8
Automatic and Controlled Precharge Command
Power Down Mode
Auto Refresh and Self Refresh
Refresh Interval: 7.8 s (8192 cycles/64 ms)
ODT (On‐Die Termination)
Weak Strength Data‐Output Driver Option
OPTIONS
Configuration:
ADDRESS TABLE
128Mx8 (16M x 8 x 8 banks)
64Mx16 (8M x 16 x 8 banks)
Parameter
128Mx8
A0‐A13
A0‐A9
64Mx16
A0‐A12
A0‐A9
Row Addressing
Column Addressing
Bank Addressing
Precharge Addressing
Package:
60‐ball TW‐BGA for x8
84‐ball TW‐BGA for x16
BA0‐BA2
A10
BA0‐BA2
A10
Clock Cycle Timing
‐3D
‐25E
‐25D
Units
Speed Grade
CL‐tRCD‐tRP
tCK (CL=3)
DDR2‐667D
DDR2‐800E
DDR2‐800D
5‐5‐5
5
6‐6‐6
5
5‐5‐5
5
tCK
ns
tCK (CL=4)
tCK (CL=5)
tCK (CL=6)
tCK (CL=7)
3.75
3
3
3
333
3.75
3
2.5
2.5
400
3.75
2.5
2.5
2.5
400
ns
ns
ns
ns
Frequency (max)
MHz
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. 0B, 08/08/2012