是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DSBGA |
包装说明: | TFBGA, | 针数: | 84 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.28 | 风险等级: | 5.34 |
访问模式: | FOUR BANK PAGE BURST | 其他特性: | AUTO/SELF REFRESH |
JESD-30 代码: | R-PBGA-B84 | JESD-609代码: | e1 |
长度: | 13 mm | 内存密度: | 536870912 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 16 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 84 | 字数: | 33554432 words |
字数代码: | 32000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 32MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
自我刷新: | YES | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 10.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS43DR16320-3DBL | ISSI |
获取价格 |
DDR DRAM, 32MX16, CMOS, PBGA84, 13 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, MO-207, FBGA-84 | |
IS43DR16320-3DBLI | ISSI |
获取价格 |
DDR DRAM, 32MX16, CMOS, PBGA84, 13 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, MO-207, FBGA-84 | |
IS43DR16320B-25DBI | ISSI |
获取价格 |
512Mb (x8, x16) DDR2 SDRAM | |
IS43DR16320B-25DBL | ISSI |
获取价格 |
512Mb (x8, x16) DDR2 SDRAM | |
IS43DR16320B-25DBLI | ISSI |
获取价格 |
512Mb (x8, x16) DDR2 SDRAM | |
IS43DR16320B-25DBLI-TR | ISSI |
获取价格 |
暂无描述 | |
IS43DR16320B-25DBL-TR | ISSI |
获取价格 |
DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD | |
IS43DR16320B-25EBL | ISSI |
获取价格 |
512Mb (x8, x16) DDR2 SDRAM | |
IS43DR16320B-25EBLI | ISSI |
获取价格 |
512Mb (x8, x16) DDR2 SDRAM | |
IS43DR16320B-25EBL-TR | ISSI |
获取价格 |
DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD |