5秒后页面跳转
IS42VM32160C-10BLI PDF预览

IS42VM32160C-10BLI

更新时间: 2024-11-13 15:42:39
品牌 Logo 应用领域
美国芯成 - ISSI 时钟动态存储器内存集成电路
页数 文件大小 规格书
17页 324K
描述
Synchronous DRAM, 16MX32, 8ns, CMOS, PBGA90, 13 X 8 MM, 0.80 MM PITCH, LEAD FREE, MS-207, FBGA-90

IS42VM32160C-10BLI 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:DSBGA
包装说明:LFBGA, BGA90,9X15,32针数:90
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.28风险等级:5.57
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:8 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PBGA-B90
JESD-609代码:e1长度:13 mm
内存密度:536870912 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:32湿度敏感等级:3
功能数量:1端口数量:1
端子数量:90字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:16MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA90,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.8 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.4 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.00004 A子类别:DRAMs
最大压摆率:0.22 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:8 mmBase Number Matches:1

IS42VM32160C-10BLI 数据手册

 浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第2页浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第3页浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第4页浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第5页浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第6页浏览型号IS42VM32160C-10BLI的Datasheet PDF文件第7页 
IS42VM32160C  
16Mx32  
Preliminary Information  
JULY 2010  
512Mb Mobile Synchronous DRAM  
FEATURES:  
DESCRIPTION:  
ISSI's IS42VM32160C is a 512Mb Mobile Synchronous  
DRAM configured as a quad 4M x32 DRAM. It achieves  
high-speed data transfer using a pipeline architecture  
with a synchronous interface. All inputs and outputs sig-  
nals are registered on the rising edge of the clock input,  
CLK. The 512Mb SDRAM is internally configured by  
stacking two 256Mb, 16Mx16 devices. Each of the 4M  
x32ꢀbanksꢀisꢀorganizedꢀasꢀ8192ꢀrowsꢀbyꢀ512ꢀcolumnsꢀ  
by 32 bits.  
•ꢀ Fully synchronous; all signals referenced to a  
positive clock edge  
•ꢀ Internal bank for hiding row access and pre-  
charge  
•ꢀ Programmable CAS latency: 2, 3  
•ꢀ Programmable Burst Length: 1, 2, 4, 8, and Full  
Page  
•ꢀ Programmable Burst Sequence:  
•ꢀ Sequential and Interleave  
•ꢀ Auto Refresh (CBR)  
•ꢀ TCSR (Temperature Compensated Self Refresh)  
KEY TIMING PARAMETERS  
Parameter  
-10  
Unit  
•ꢀ PASR (Partial Arrays Self Refresh): 1/16, 1/8,  
1/4, 1/2, and Full  
•ꢀ Deep Power Down Mode (DPD)  
•ꢀ Driver Strength Control (DS): 1/4, 1/2, and Full  
CLK Cycle Time  
CAS Latency = 3  
CAS Latency = 2  
CLK Frequency  
CAS Latency = 3  
CAS Latency = 2  
Access Time from CLK  
CAS Latency = 3  
CAS Latency = 2  
10  
12  
ns  
ns  
OPTIONS:  
•ꢀ Configuration:ꢀ16Mx32  
•ꢀ PowerꢀSupply:  
Vd d /Vd d q = 1.8V  
•ꢀ Package:ꢀ90ꢀBallꢀBGAꢀ(8mmx13mm)  
•ꢀ TemperatureꢀRange:ꢀ  
Commercial (0oC to +70oC)  
Industrial (-40oC to +85oC)  
100  
83  
Mhz  
Mhz  
8.0  
ns  
ns  
9.0  
•ꢀ Dieꢀrevision:ꢀC  
ADDRESS TABLE  
Parameter  
16Mx32  
Configuration  
4M x 32 x 4 banks  
BA0, BA1  
A10/AP  
A0 – A12  
A0 – A8  
Bank Address Pins  
Autoprecharge Pins  
Row Addresses  
Column Addresses  
Refresh Count  
8K / 64ms  
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without  
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-  
est version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-  
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications  
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc.  
1
Rev. 00B  
07/21/2010  

与IS42VM32160C-10BLI相关器件

型号 品牌 获取价格 描述 数据表
IS42VM32160C-10BLI-TR ISSI

获取价格

Synchronous DRAM, 16MX32, 8ns, CMOS, PBGA90,
IS42VM32160C-10BL-TR ISSI

获取价格

Synchronous DRAM, 16MX32, 8ns, CMOS, PBGA90,
IS42VM32160C-75BI ISSI

获取价格

Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, MS-207, FBGA-90
IS42VM32160C-75BL ISSI

获取价格

Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, MS-207
IS42VM32160C-75BLI ISSI

获取价格

Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, MS-207
IS42VM32160D-6BLI ISSI

获取价格

Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, MO-207, TFBGA-90
IS42VM32160D-75BLI ISSI

获取价格

Synchronous DRAM, 16MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, MO-207, TFBGA-90
IS42VM32160E-6BLA1 ISSI

获取价格

Synchronous DRAM, 16MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, MO-207, TFBGA-90
IS42VM32160E-6BLA2 ISSI

获取价格

Synchronous DRAM, 16MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, MO-207, TFBGA-90
IS42VM32160E-6BLI ISSI

获取价格

Synchronous DRAM, 16MX32, 5.5ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, MO-207, TFBGA-90